Semiconductor package structure
AssigneesIndustrial Technology Research Institute, Win-House Electronic Co.,Ltd.
InventorsJing-Yao Chang, Tao-Chih Chang, Kuo-Shu Kao, Fang-Jun Leu, Hsin-Han Lin, Chih-Ming Tzeng, Hsiao-Ming Chang, Chih-Ming Shen
Life of this patent
Estimating the term…
Abstract
A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor chip, a guard ring, a gel layer, and a first lead frame. The guard ring is disposed on the semiconductor chip, and the gel layer is disposed on the guard ring. The first lead frame is electrically connected to the semiconductor chip, and the gel layer is located between the guard ring and the first lead frame.
Claims20
A semiconductor package structure, comprising:
- a semiconductor chip having a first surface;
- a guard ring disposed on the first surface of the semiconductor chip;
- a solder disposed on the first surface of the semiconductor chip;
- a first lead frame having a first width, electrically connected to the semiconductor chip through the solder;
- a gel layer disposed in a space between the semiconductor chip and the first lead frame where the semiconductor chip and the first lead frame are overlapped in a normal direction of the first surface of the semiconductor chip, such that the first lead frame is raised by the gel layer to separate the first lead frame from the guard ring;
- and
- an encapsulation layer covering the guard ring, the gel layer and the first lead frame;
- wherein a partial region of the semiconductor chip is non-overlapped with each of the guard ring, the gel layer and the solder in a normal direction of the first surface of the semiconductor chip, and the partial region has a second width along the direction of the first width, and the first width is 40-100% of the second width.
A semiconductor package structure, comprising:
- a semiconductor chip having a first surface;
- a guard ring disposed on the first surface of the semiconductor chip;
- a solder disposed on the first surface of the semiconductor chip;
- a first lead frame having a first width, electrically connected to the semiconductor chip through the solder;
- and
- a gel layer disposed in a space between the semiconductor chip and the first lead frame where the semiconductor chip and the first lead frame are overlapped in a normal direction of the first surface of the semiconductor chip, such that the first lead frame is raised by the gel layer to separate the first lead frame from the guard ring;
- wherein a partial region of the semiconductor chip is non-overlapped with each of the guard ring, the gel layer and the solder in a normal direction of the first surface of the semiconductor chip, and the partial region has a second width along the direction of the first width, and the first width is 40-100% of the second width.
A semiconductor package structure, comprising:
- a semiconductor chip having a first surface;
- a guard ring disposed on the first surface of the semiconductor chip;
- a solder disposed on the first surface of the semiconductor chip;
- a first lead frame having a first width and a second surface being faced to the first surface of the semiconductor chip and with a shortest distance to the first surface of the semiconductor chip, electrically connected to the semiconductor chip through the solder;
- and
- a gel layer disposed in a space between the first surface and the second surface, such that the first lead frame and the guard ring are separated by the gel layer;
- wherein a partial region of the semiconductor chip is non-overlapped with each of the guard ring, the gel layer and the solder in a normal direction of the first surface of the semiconductor chip, and the partial region has a second width along the direction of the first width, and the first width is 40-100% of the second width.
Dependencies are inferred from the claim text.