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US 12,713,940 B2Granted
Power semiconductor device attached to a lead frame
AssigneeNexperia B.V.
InventorsMatthew Lloyd Anthony, Ricardo Lagmay Yandoc, Manoj Balakrishnan, Adam Richard Brown
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Abstract
A semiconductor device is provided that includes a lead frame, a die attached to the lead frame using a first solder, a clip attached to the die using a second solder, and a copper slug attached to the clip. First gull wing leads are attached to the leadframe for a drain connection of the semiconductor device. Second gull wing leads are attached to the clip for a gate connection and for a source connection of the semiconductor device.
Claims13
A semiconductor device comprising:
- a lead frame;
- a die attached to the lead frame using a first solder;
- a clip attached to the die using a second solder;
- a copper slug attached to the clip, wherein the copper slug has an exposed face that forms an exposed source pad at a bottom surface of the semiconductor device;
- and
- an exposed drain pad exposed through moulding at a top surface of the semiconductor device,
- wherein the lead frame has first gull wing leads attached for a drain connection of the semiconductor device.
4 more elements
A method of producing a semiconductor device, the method comprising the steps of:
- stencil printing of a solder on a leadframe matrix;
- attaching a die to the leadframe;
- stencil printing of a solder to the die;
- attaching a clip to the die, which clip forms a top pad;
- providing a moulding of the leadframe in a book mold press to form a package;
- polishing through the top of the package wherein a top drain is exposed;
- and
- singulation of the package wherein gull-wing leads are formed.
5 more elements
Dependencies are inferred from the claim text.