H10W 72/07631
Techniques
Official title: {Techniques}
H10W72/07631 (Techniques) appears on 1,358 US grants and 1,623 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,358
- Published applications
- 1,623
- Assignees
- 287
- Inventors
- 2,025
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 6 | 6 |
| 2002 | 11 | 21 |
| 2003 | 18 | 16 |
| 2004 | 16 | 30 |
| 2005 | 19 | 33 |
| 2006 | 28 | 53 |
| 2007 | 26 | 77 |
| 2008 | 31 | 61 |
| 2009 | 40 | 63 |
| 2010 | 57 | 52 |
| 2011 | 51 | 64 |
| 2012 | 59 | 94 |
| 2013 | 85 | 103 |
| 2014 | 82 | 105 |
| 2015 | 104 | 109 |
| 2016 | 97 | 97 |
| 2017 | 88 | 87 |
| 2018 | 66 | 64 |
| 2019 | 63 | 71 |
| 2020 | 53 | 67 |
| 2021 | 68 | 103 |
| 2022 | 62 | 78 |
| 2023 | 65 | 61 |
| 2024 | 59 | 41 |
| 2025 | 47 | 34 |
| 2026 | 19 | 33 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the method8 Sep 2026US 12,733,527 B2JMJ Korea Co., Ltd.
- Power semiconductor device attached to a lead frame18 Aug 2026US 12,713,940 B2Nexperia B. V.
- Method of manufacturing semiconductor devices and corresponding semiconductor device11 Aug 2026US 12,707,994 B2STMicroelectronics S,r.l.
- Semiconductor device4 Aug 2026US 12,702,054 B2Fuji Electric Co., Ltd.
- Electronic device having a soldered joint between a metal region of a semiconductor die and a metal region of a substrate21 Jul 2026US 12,690,481 B2Infineon Technologies Austria AG
- Method of manufacturing a plurality of semiconductor devices as well as a corresponding semiconductor device24 Sep 2026US 2026/0293703 A1Nexperia B. V.
- Monolithic spring assemblies for high-frequency press-pack modules20 Aug 2026US 2026/0248017 A1
- Semiconductor package having dual transistors and method of making the same6 Aug 2026US 2026/0231820 A1Alpha and Omega Semiconductor International LP
- Semiconductor manufacturing apparatus and method of manufacturing semiconductor device23 Jul 2026US 2026/0215207 A1Mitsubishi Electric Corporation
- Power semiconductor package having stacked fet dies and method for fabricating the same16 Jul 2026US 2026/0206634 A1
Most cited
By later US patents
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Self-centering electrode for power devices249US 4,935,803 AMotorola, Inc. · 1990
- Semiconductor package243US 6,040,626 AInternational Rectifier Corporation · 2000
- Symmetrical package for semiconductor die208US 6,256,200 B12001
- Mold-type semiconductor device207US 5,218,231 AKabushiki Kaisha Toshiba · 1993