H10W 72/07636
Soldering or alloying
Official title: {Soldering or alloying}
H10W72/07636 (Soldering or alloying) appears on 1,144 US grants and 1,355 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,144
- Published applications
- 1,355
- Assignees
- 235
- Inventors
- 1,668
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 5 | 5 |
| 2002 | 8 | 16 |
| 2003 | 12 | 12 |
| 2004 | 12 | 25 |
| 2005 | 16 | 31 |
| 2006 | 24 | 46 |
| 2007 | 23 | 68 |
| 2008 | 26 | 53 |
| 2009 | 35 | 49 |
| 2010 | 48 | 43 |
| 2011 | 45 | 49 |
| 2012 | 49 | 82 |
| 2013 | 68 | 88 |
| 2014 | 72 | 97 |
| 2015 | 96 | 94 |
| 2016 | 85 | 88 |
| 2017 | 74 | 72 |
| 2018 | 57 | 45 |
| 2019 | 55 | 64 |
| 2020 | 44 | 54 |
| 2021 | 60 | 88 |
| 2022 | 51 | 63 |
| 2023 | 55 | 45 |
| 2024 | 47 | 30 |
| 2025 | 35 | 23 |
| 2026 | 10 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power semiconductor device attached to a lead frame18 Aug 2026US 12,713,940 B2Nexperia B. V.
- Method of manufacturing semiconductor devices and corresponding semiconductor device11 Aug 2026US 12,707,994 B2STMicroelectronics S,r.l.
- Semiconductor device4 Aug 2026US 12,702,054 B2Fuji Electric Co., Ltd.
- Electronic device having a soldered joint between a metal region of a semiconductor die and a metal region of a substrate21 Jul 2026US 12,690,481 B2Infineon Technologies Austria AG
- Clip interconnect with micro contact heads2 Jun 2026US 12,648,455 B2Semiconductor Components Industries, LLC
- Method of manufacturing a plurality of semiconductor devices as well as a corresponding semiconductor device24 Sep 2026US 2026/0293703 A1Nexperia B. V.
- Semiconductor package having dual transistors and method of making the same6 Aug 2026US 2026/0231820 A1Alpha and Omega Semiconductor International LP
- Power semiconductor package having stacked fet dies and method for fabricating the same16 Jul 2026US 2026/0206634 A1
- Semiconductor device module with stacked interconnections and methods of manufacture11 Jun 2026US 2026/0165118 A1Semiconductor Components Industries, LLC
- Semiconductor package and a bond clip for use in the semiconductor package4 Jun 2026US 2026/0157243 A1Nexperia B. V.
Most cited
By later US patents
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Self-centering electrode for power devices249US 4,935,803 AMotorola, Inc. · 1990
- Symmetrical package for semiconductor die208US 6,256,200 B12001
- Mold-type semiconductor device207US 5,218,231 AKabushiki Kaisha Toshiba · 1993
- Wireless radio frequency power semiconductor devices using high density interconnect171US 5,637,922 AGeneral Electric Company · 1997