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US 12,707,994 B2Granted
Method of manufacturing semiconductor devices and corresponding semiconductor device
AssigneeSTMicroelectronics S.r.l.
InventorsMauro Mazzola, Fabio Marchisi
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes an electrically conductive clip arranged in a bridge-like position between a semiconductor integrated circuit chip and an electrically conductive pad of a leadframe. The electrically conductive clip is soldered to the semiconductor integrated circuit chip and to the electrically conductive pad via soldering material applied at coupling surfaces facing towards the semiconductor integrated circuit chip and the electrically conductive pad. Prior to soldering, the clip is immobilized in the desired bridge-like position via one of welding (such as laser welding) or gluing at dedicated immobilization areas.
Claims23
A device, comprising:
- a substrate comprising an electrically conductive pad and a die pad;
- a semiconductor integrated circuit chip mounted to the die pad of the substrate;
- an electrically conductive clip positioned in a bridge-like position between the semiconductor integrated circuit chip and the electrically conductive pad, the electrically conductive clip having coupling surfaces facing towards the semiconductor integrated circuit chip and the electrically conductive pad;
- solder material applied at said coupling surfaces of the electrically conductive clip in said bridge-like position, the solder material electrically coupling the electrically conductive clip to the semiconductor integrated circuit chip and to electrically conductive pad;
- and
- a laser weld in addition to said solder material that fixes the electrically conductive clip in said bridge-like position to the electrically conductive pad.
3 more elements
A device, comprising:
- a substrate comprising an electrically conductive pad and a die pad;
- a semiconductor integrated circuit chip mounted to the die pad of the substrate;
- an electrically conductive clip positioned in a bridge-like position between the semiconductor integrated circuit chip and the electrically conductive pad, the electrically conductive clip having coupling surfaces facing towards the semiconductor integrated circuit chip and the electrically conductive pad;
- wherein the coupling surface of the electrically conductive clip facing towards the electrically conductive pad includes a protruding portion defining a containment wall;
- a weld at the containment wall to fix the electrically conductive clip to the electrically conductive pad;
- and
- solder material applied at said coupling surfaces of the electrically conductive clip in said bridge-like position, the solder material electrically coupling the electrically conductive clip to the semiconductor integrated circuit chip and to electrically conductive pad;
- wherein the solder material at the electrically conductive pad is contained by the containment wall.
5 more elements
A device, comprising:
- a substrate comprising an electrically conductive pad and a die pad;
- a semiconductor integrated circuit chip mounted to the die pad of the substrate;
- an electrically conductive clip positioned in a bridge-like position between the semiconductor integrated circuit chip and the electrically conductive pad, the electrically conductive clip having coupling surfaces facing towards the semiconductor integrated circuit chip and the electrically conductive pad;
- wherein the coupling surface of the electrically conductive clip facing towards the electrically conductive pad includes a protruding portion defining a containment wall;
- a glue spot at the containment wall to fix the electrically conductive clip to the electrically conductive pad;
- and
- solder material applied at said coupling surfaces of the electrically conductive clip in said bridge-like position, the solder material electrically coupling the electrically conductive clip to the semiconductor integrated circuit chip and to electrically conductive pad;
- wherein the solder material at the electrically conductive pad is contained by the containment wall.
5 more elements
A device, comprising:
- a substrate comprising an electrically conductive pad and a die pad;
- a semiconductor integrated circuit chip mounted to the die pad of the substrate;
- an electrically conductive clip positioned in a bridge-like position between the semiconductor integrated circuit chip and the electrically conductive pad, the electrically conductive clip having coupling surfaces facing towards the semiconductor integrated circuit chip and the electrically conductive pad;
- solder material applied at said coupling surfaces of the electrically conductive clip in said bridge-like position, the solder material electrically coupling the electrically conductive clip to the semiconductor integrated circuit chip and to electrically conductive pad;
- and
- an electrically insulating glue in addition to said solder material that fixes the electrically conductive clip in said bridge-like position to at least one of the electrically conductive pad and the semiconductor integrated circuit chip.
3 more elements
Dependencies are inferred from the claim text.