Semiconductor package and a bond clip for use in the semiconductor package

A semiconductor package comprising:

• a semiconductor die having a first die side and a second die side opposite to the first die side;
• a lead frame having lead terminals, a first frame side and a second frame side opposite to the first frame side, wherein the first die side of the semiconductor die is attached to the second frame side of the lead frame;
• at least one bond clip electrically and mechanically connecting the second die side of the semiconductor die to at least one of the lead terminals;
• a die top solder connecting the bond clip and the semiconductor die;
• and
• an electrically insulating encapsulant at least partly encapsulating the lead frame, the semiconductor die, the at least one bond clip and the lead terminals,
• wherein the bond clip at least comprises a die attachment portion having a die attachment portion side structured to be connected to the second die side of the semiconductor die, and a lead terminal attachment portion structured to be connected to the lead terminal of the lead frame, and
• wherein the die attachment portion side of the die attachment portion is provided with a cavity functioning as an expansion space for the die top solder.