H10W 72/07635
Applying em radiation
Official title: {Applying EM radiation, e.g. induction heating or using a laser}
H10W72/07635 (Applying em radiation) appears on 56 US grants and 67 published applications in this corpus.
Search patents in H10W- Granted patents
- 56
- Published applications
- 67
- Assignees
- 34
- Inventors
- 107
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 2 |
| 2008 | 0 | 2 |
| 2009 | 0 | 2 |
| 2010 | 2 | 2 |
| 2011 | 2 | 1 |
| 2012 | 2 | 2 |
| 2013 | 2 | 1 |
| 2014 | 2 | 2 |
| 2015 | 3 | 2 |
| 2016 | 2 | 4 |
| 2017 | 3 | 3 |
| 2018 | 5 | 4 |
| 2019 | 3 | 4 |
| 2020 | 1 | 4 |
| 2021 | 1 | 9 |
| 2022 | 5 | 9 |
| 2023 | 9 | 7 |
| 2024 | 10 | 4 |
| 2025 | 2 | 1 |
| 2026 | 2 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing semiconductor devices and corresponding semiconductor device11 Aug 2026US 12,707,994 B2STMicroelectronics S,r.l.
- Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor17 Mar 2026US 12,581,983 B2Danfoss Silicon Power GmbH
- Semiconductor devices having exposed clip top sides and methods of manufacturing semiconductor devices16 Sep 2025US 12,418,135 B2Amkor Technology Singapore Holding Pte.Ltd.
- Power semiconductor apparatus and fabrication method for the same7 Jan 2025US 12,191,275 B2Rohm Co., Ltd.
- Electrical connection member, electrical connection structure, and method for manufacturing electrical connection member24 Dec 2024US 12,176,315 B2Hitachi Metals, Ltd.
- Joint structure, semiconductor device, manufacturing method of joint structure, and manufacturing method of semiconductor device19 Mar 2026US 2026/0082967 A1Fuji Electric Co., Ltd.
- Semiconductor devices and methods of manufacturing semiconductor devices4 Dec 2025US 2025/0372914 A1Amkor Technology Singapore Holding Pte.Ltd.
- Power Module28 Nov 2024US 2024/0395677 A1Wolfspeed, Inc.
- Semiconductor device and bonding method14 Nov 2024US 2024/0379610 A1Rohm Co., Ltd.
- Semiconductor devices and methods of manufacturing semiconductor devices20 Jun 2024US 2024/0204444 A1Amkor Technology Singapore Holding Pte.Ltd.
Most cited
By later US patents
- Power semiconductor module having low gate drive inductance flexible board connection8US 9,355,950 B1Infineon Technologies AG · 2016
- Semiconductor device7US 8,030,749 B2Fuji Electric Systems Co., Ltd. · 2011
- Semiconductor device7US 8,441,117 B2Fuji Electric Co., Ltd. · 2013
- Metallization with tailorable coefficient of thermal expansion6US 8,141,556 B2Medtronic, Inc. · 2012
- Semiconductor power conversion apparatus and method of manufacturing the same5US 8,058,554 B2Toyota Jidosha Kabushiki Kaisha · 2011