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US 8,030,749 B2Granted
Semiconductor device
AssigneeFuji Electric Systems Co., Ltd.
InventorsShin Soyano, Katsumichi Ueyanagi
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a resin case, a plurality of external connection terminals fixedly provided on the resin case, and at least one semiconductor element provided in the resin case. At least one terminal block has at least one wiring terminal for electrically connecting the semiconductor element and the external connection terminals.
Claims9
A semiconductor device, comprising:
- a resin case having at least one pin;
- a plurality of external connection terminals fixedly provided on the resin case;
- at least one semiconductor element provided in the resin case;
- and
- at least one terminal block having
- at least one wiring terminal for electrically connecting the at least one semiconductor element and at least one of the external connection terminals and
- a support substrate for supporting the at least one wiring terminal,
- wherein the support substrate has at least one first notch, the first notch being fitted with the at least one pin to fix the at least one terminal block to the resin case.
5 more elements
A semiconductor device, comprising:
- a resin case;
- a plurality of external connection terminals fixedly provided on the resin case;
- at least one semiconductor element provided in the resin case;
- at least one terminal block having at least one wiring terminal for electrically connecting the at least one semiconductor element and at least one of the external connection terminals;
- and
- an insulating substrate provided in the resin case, and a terminal holder provided on the insulating substrate for supporting the wiring terminal, wherein the terminal block has an extension portion to surround an outer circumference of a connecting portion between the wiring terminal and the terminal holder.
3 more elements
A semiconductor device, comprising:
- a resin case;
- a plurality of external connection terminals fixedly provided on the resin case;
- a semiconductor element provided in the resin case;
- an insulating substrate fixed in the resin case;
- a wiring terminal for electrically connecting the semiconductor element and at least one of the external connection terminals, the wiring terminal being disposed under the insulating substrate and partly fixed thereto;
- and
- a terminal holder disposed under the wiring terminal for connecting the at least one external connection terminal and the semiconductor element through the wiring terminal.
4 more elements
Dependencies are inferred from the claim text.