Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorShin Soyano
Life of this patent
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Abstract
In some aspects of the invention, an insulating substrate fixed onto a metal base plate can include an insulating plate and metal foils. A semiconductor element can be disposed on each of the metal foils. External connection terminals can be fixed to a set of ends of terminal holders, respectively. The other ends of the terminal holders can be bonded to the metal foils, respectively. External connection terminals which are main terminals through which main current flows are disposed on a lid. By preparing a plurality of lids having different layouts of the external connection terminals, in which the external connection terminals are connected to the terminal holders in the resin case, respectively, and exchanging the lids, the positions of the external connection terminals can be easily changed.
Claims11
A semiconductor device comprising:
- a resin case;
- an insulating lid fixed and supported on the resin case;
- an insulating substrate which is housed in the resin case and which includes a plurality of conductive patterns;
- a semiconductor element fixed to at least one of the conductive patterns;
- a plurality of connection conductors connecting the conductive patterns together and connecting surface electrodes of the semiconductor element and the conductive patterns;
- terminal holders connected to the conductive patterns;
- and
- external connection terminals connected to the terminal holders,
- wherein the lid includes the external connection terminals and a lid plate that fixes and supports the external connection terminals.
A semiconductor device comprising:
- a resin case;
- an insulating lid fixed and supported on the resin case;
- an insulating substrate which is housed in the resin case and which includes a plurality of conductive patterns;
- a semiconductor element fixed to at least one of the conductive patterns;
- a plurality of connection conductors connecting the conductive patterns together and connecting surface electrodes of the semiconductor element and the conductive patterns;
- a resin plate which bridges openings of the resin case and which is fixed to inner walls of the resin case;
- conductors disposed on the resin plate;
- terminal holders connected to the conductors;
- and
- external connection terminals connected to the terminal holders,
- wherein the lid includes the external connection terminals and a lid plate that fixes and supports the external connection terminals.
Dependencies are inferred from the claim text.