Semiconductor power conversion apparatus and method of manufacturing the same

A method of manufacturing a semiconductor power conversion apparatus comprising:

• a first process of electrically connecting a bus bar with an electrode of a semiconductor device, said bus bar being configured to include a connection section with said electrode of said semiconductor device and a non-connection section with said electrode that are integrally shaped, said connection section having a thermal stress relief mechanism for relieving thermal stress acting on a connection part with said electrode;
• said connection part being electrically connected with said electrode without through bonding wire in a state of being opposed to said electrode;
• and
• a second process for forming an insulating protection coat for said connection part of said bus bar with said electrode formed through said first process, wherein
• said connection part is formed to have a thickness smaller than that of said non-connection section thereby forming said thermal stress relief mechanism,
• said non-connection section is arranged common to a plurality of said semiconductor devices to extend in a first direction, and
• said connection section is provided corresponding to each said semiconductor device in such a shape that branches from said non-connection section and extends in a second direction crossing said first direction, and said connection section has at least a portion in thickness smaller than said non-connection section.