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US 8,141,556 B2Granted
Metallization with tailorable coefficient of thermal expansion
AssigneeMedtronic, Inc.
InventorDavid A. Ruben
Life of this patent
Estimating the term…
Abstract
The present invention is directed to an interconnect for an implantable medical device. The interconnect includes a pad and a first layer introduced over the pad. At least one of the pad or the first layer comprise a negative coefficient of thermal expansion (CTE) material.
Claims10
An interconnect for an implantable medical device comprising:
- a pad;
- and
- a first layer introduced over the pad, wherein one of the pad and the first layer comprise a negative coefficient of thermal expansion material comprising niobium pentoxide (Nb2O5);
- wherein one of the pad and the first layer comprises a range of 25 to 75 of Nb and 75 to 25 of Nb2O5 in a Nb/Nb2O5 ratio.
1 more element
A joint in an implantable medical device comprising:
- a substrate;
- a conductor;
- an interconnect coupled to the substrate and to the conductor, the interconnect comprising:
- a pad;
- and
- a first layer introduced over the pad, wherein one of the pad and the first layer comprises a negative coefficient of thermal expansion material;
- wherein one of the pad and the first layer comprises a range of 25 to 75 of Nb and 75 to 25 of Nb2O5 in a Nb/Nb2O5 ratio.
4 more elements
A joint in an implantable medical device comprising:
- a first element;
- a second element;
- an interconnect coupled to the first and the second elements, the interconnect comprising:
- a pad;
- and
- a first layer introduced over the pad, wherein one of the pad and the first layer comprises a negative coefficient of thermal expansion material;
- wherein one of the pad and the first layer comprises a range of 25 to 75 of Nb and 75 to 25 of Nb2O5 in a Nb/Nb2O5ratio.
4 more elements
A joint in an implantable medical device comprising:
- a first element;
- a second element;
- an interconnect coupled to the first and the second elements, the interconnect comprising:
- a pad;
- and
- a first layer introduced over the pad, wherein one of the pad and the first layer comprises a negative coefficient of thermal expansion material;
- wherein the joint is used to connect a sensor and a conductor;
- and
- wherein the sensor being one of a pressure sensor, an optical sensor, a biochemical sensor, a protein sensor, a motion sensor, a temperature sensor, a chemical sensor, and a genetic sensor.
6 more elements
Dependencies are inferred from the claim text.