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US 12,176,315 B2Granted
Electrical connection member, electrical connection structure, and method for manufacturing electrical connection member
AssigneeHitachi Metals, Ltd.
InventorsJunya Nishina, Masaaki Ishio
Life of this patent
Estimating the term…
Abstract
An electrical connection member (1, 301, 401, 501, 601) includes a clad material (10, 110, 610) including at least both a first Cu layer (12) made of a Cu material and a low thermal expansion layer (11) made of an Fe material or Ni material having an average thermal expansion coefficient from room temperature to 300° C. smaller than that of the first Cu layer, the first Cu layer and the low thermal expansion layer being bonded to each other.
Claims10
An electrical connection member (1, 301, 401, 501, 601) comprising:
- a clad material (10, 110, 610) including at least both a first Cu layer (12) made of a Cu material and a low thermal expansion layer (11) made of an Fe material or Ni material having an average thermal expansion coefficient from room temperature to 300° C. smaller than that of the first Cu layer, the first Cu layer and the low thermal expansion layer being bonded to each other;
- wherein a surface of the clad material on a side of the first Cu layer includes a first surface (14a) connected to a first connection target member and a second surface (14b) directly connected to the first surface via a step (15), which inclines with regard to a stacking direction, and located closer to the low thermal expansion layer than the first surface and connected to a second connection target member, a first thickness of the clad material of the first surface is greater than a second thickness of the clad material of the second surface, and wherein a thickness of the clad material gradually decreases from the first thickness of the first surface to the second thickness of the second surface in the step.
An electrical connection structure (100a) comprising:
- an electrical connection member (1, 301, 401, 501, 601) including a clad material (10, 110, 610) that includes at least both a first Cu layer (12) made of a Cu material and a low thermal expansion layer (11) made of an Fe material or Ni material having an average thermal expansion coefficient from room temperature to 300° C. smaller than that of the first Cu layer, the first Cu layer and the low thermal expansion layer being bonded to each other, the clad material having a surface on a side of the first Cu layer, the surface including a first surface (14a) connected to a first connection target member and a second surface (14b) directly connected to the first surface via a step (15), which inclines with regard to a stacking direction, and located closer to the low thermal expansion layer than the first surface and connected to a second connection target member, a first thickness of the clad material of the first surface is greater than a second thickness of the clad material of the second surface, and wherein a thickness of the clad material gradually decreases from the first thickness of the first surface to the second thickness of the second surface in the step;
- and a connection material to connect the electrical connection member to the first connection target member in an electrical connection portion of the first surface and to connect the electrical connection member to the second connection target member in an electrical connection portion of the second surface.
Dependencies are inferred from the claim text.