Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
AssigneeMitsubishi Electric Corporation
InventorYusuke YADANI
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Abstract
A semiconductor manufacturing apparatus includes a tool performing joining by ultrasonic vibration while applying a load to a metal terminal. The tool includes a plurality of protrusions arranged along the X-axis direction and the Y-axis direction on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal. The intervals between the plurality of protrusions are equal in the X direction of the pressing surface, and are larger on the inner peripheral side than on the outer peripheral side in the Y-axis direction of the pressing surface.
Claims2
A semiconductor manufacturing apparatus comprising
- a tool performing joining by ultrasonic vibration while applying a load to a metal terminal, wherein
- the tool includes a plurality of protrusions arranged on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal along a first direction and a second direction that is a direction intersecting the first direction, and
- widths of the plurality of protrusions decrease from an outer peripheral side toward an inner peripheral side of the pressing surface.
A method of manufacturing a semiconductor device by performing joining by ultrasonic vibration while applying a load to a metal terminal with a tool, wherein
- the tool includes a plurality of protrusions arranged on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal along a first direction and a second direction that is a direction intersecting the first direction, and
- widths of the plurality of protrusions decrease from an outer peripheral side toward an inner peripheral side of the pressing surface.
Dependencies are inferred from the claim text.