H10W 72/07637
Using a polymer adhesive
Official title: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
H10W72/07637 (Using a polymer adhesive) appears on 468 US grants and 533 published applications in this corpus.
Search patents in H10W- Granted patents
- 468
- Published applications
- 533
- Assignees
- 129
- Inventors
- 713
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 4 |
| 2002 | 10 | 14 |
| 2003 | 12 | 8 |
| 2004 | 9 | 9 |
| 2005 | 8 | 11 |
| 2006 | 11 | 19 |
| 2007 | 10 | 33 |
| 2008 | 16 | 28 |
| 2009 | 15 | 25 |
| 2010 | 22 | 19 |
| 2011 | 29 | 36 |
| 2012 | 24 | 39 |
| 2013 | 42 | 36 |
| 2014 | 32 | 44 |
| 2015 | 43 | 42 |
| 2016 | 37 | 38 |
| 2017 | 37 | 31 |
| 2018 | 23 | 20 |
| 2019 | 16 | 12 |
| 2020 | 13 | 16 |
| 2021 | 13 | 21 |
| 2022 | 12 | 9 |
| 2023 | 12 | 6 |
| 2024 | 5 | 3 |
| 2025 | 7 | 4 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing semiconductor devices and corresponding semiconductor device11 Aug 2026US 12,707,994 B2STMicroelectronics S,r.l.
- Clip interconnect with micro contact heads2 Jun 2026US 12,648,455 B2Semiconductor Components Industries, LLC
- Semiconductor device and method of forming clip bond having multiple bond line thicknesses13 Jan 2026US 12,525,567 B2UTAC Headquarters Pte. Ltd.
- Semiconductor device9 Sep 2025US 12,412,823 B2Renesas Electronics Corporation
- Semiconductor device package assemblies with direct leadframe attachment27 May 2025US 12,315,826 B2Semiconductor Components Industries, LLC
- Semiconductor package having dual transistors and method of making the same6 Aug 2026US 2026/0231820 A1Alpha and Omega Semiconductor International LP
- Power semiconductor package having stacked fet dies and method for fabricating the same16 Jul 2026US 2026/0206634 A1
- Die stack on copper clip and double-sided cooling14 May 2026US 2026/0137012 A1Qorvo US, Inc.
- Transistor chip package with bent clip19 Mar 2026US 2026/0082939 A1
- Universal Surface-Mount Semiconductor Package12 Mar 2026US 2026/0076242 A1Adventive International Ltd.
Most cited
By later US patents
- Semiconductor package243US 6,040,626 AInternational Rectifier Corporation · 2000
- Symmetrical package for semiconductor die208US 6,256,200 B12001
- Ball grid array semiconductor package and substrate without power ring or ground ring191US 6,667,546 B2Siliconware Precision Industries Co., Ltd. · 2003
- Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die149US 6,307,755 B12001
- Semiconductor device package114US 7,045,884 B2International Rectifier Corporation · 2006