Semiconductor device
AssigneeRenesas Electronics Corporation
InventorTatsuaki Tsukuda
Life of this patent
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Abstract
A performance of a semiconductor device is improved. The semiconductor device includes a semiconductor chip, and a clip mounted on the semiconductor chip via a silver paste. Here, the semiconductor chip includes a passivation film having an opening, a source pad of a main transistor having a portion exposed from the passivation film at the opening, and a wall portion provided on the passivation film so as to surround the source pad in a plan view. At this time, a whole of the portion (exposed surface) of the source pad, which is exposed from the passivation film, is covered with the silver paste. Further, in the plan view, the silver paste connecting the source pad with the clip is positioned inside of an area surrounded by the wall portion, without overflowing.
Claims17
A semiconductor device comprising:
- a chip mounting portion;
- a semiconductor chip mounted on the chip mounting portion, the semiconductor chip including:
- a passivation film having an opening;
- a first pad having a portion exposed from the passivation film at the opening;
- and
- a wall portion provided on the passivation film so as to surround the first pad in a plan view;
- and
- a clip connected to the first pad of the semiconductor chip via a first silver paste,
- wherein, in a cross-sectional view, a thickness of the wall portion is larger than a thickness of the passivation film,
- wherein a whole of the portion of the first pad, which is exposed from the passivation film, is covered with the first silver paste, and
- wherein, in the plan view, the first silver paste connecting the clip to the first pad is positioned inside of an area surrounded by the wall portion.
Dependencies are inferred from the claim text.