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US 7,045,884 B2Granted
Semiconductor device package
AssigneeInternational Rectifier Corporation
InventorMartin Standing
Life of this patent
Estimating the term…
Abstract
A semiconductor package that includes two circuit boards and at least one semiconductor device which is disposed between the two circuit boards and connected to external connectors disposed on at least one of the circuit boards.
Claims20
A semiconductor package comprising:
- a first circuit board including at least one conductive pad disposed on a major surface thereof;
- a second circuit board including at least one conductive pad on a major surface thereof;
- and
- a semiconductor die including a first electrical contact on a first major surface thereof and a second electrical contact on a second major surface thereof;
- a first layer of conductive adhesive interposed between, and mechanically connected to, said first electrical contact and said at least one conductive pad on said first circuit board;
- and
- a second layer of conductive adhesive interposed between, and mechanically connected to, said second electrical contact and said at least one conductive pad on said second circuit board;
- whereby said first electrical contact is electrically connected to said at least one conductive pad on said first circuit board and said second electrical contact is electrically connected to said at least one conductive pad on said second circuit board.
5 more elements
A semiconductor package comprising:
- a first thermally conductive substrate including a plurality of conductive pads disposed on a first major surface thereof;
- a second thermally conductive substrate including a plurality of conductive pads disposed on a first major surface thereof;
- a plurality of power semiconductor devices each including a first power contact on a first major surface thereof, a second power contact and a control contact on a second opposing major surface thereof;
- a first layer of conductive adhesive interposed between, and mechanically connected to, a first power contact of each power semiconductor device and a respective conductive pad on said first thermally conductive substrate,
- a second layer of conductive adhesive interposed between, and mechanically connected to, a second power contact of each power semiconductor device and a respective conductive pad on said second thermally conductive substrate;
- and a third layer of conductive adhesive interposed between, and mechanically connected to, a control contact of each power semiconductor device and a respective conductive pad on said second thermally conductive substrate;
- whereby each one of said contacts of said power semiconductor devices is electrically connected to a respective one of said plurality of conductive pads, and wherein said conductive pads on said thermally conductive substrate are interconnected to form part of a circuit.
4 more elements
Dependencies are inferred from the claim text.