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US 2026/0137012 A1Published application
Die stack on copper clip and double-sided cooling
AssigneeQorvo US, Inc.
InventorMD Hasnine
Life of this patent
Estimating the term…
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AssigneeQorvo US, Inc.
InventorMD Hasnine
Estimating the term…
Aspects of the disclosure provide a semiconductor package and one or more methods of producing the same. The disclosed semiconductor package includes a lead-frame substrate; a first die attached to a first side of the substrate via a first layer of a coefficient of thermal expansion (CTE)-matched copper paste at a first location on the first side of the substrate; a first set of copper clips attached to the first die and a second location on the first side of the substrate via a second layer of CTE-matched copper paste; a second die attached to the first die via a third layer of CTE-matched copper paste; and a second set of copper clips attached to the second die and a third location on the first side of the substrate via a fourth layer of CTE-matched copper paste. In various embodiments, a wireless device includes the disclosed semiconductor package.
A semiconductor package, comprising:
A method for forming a semiconductor package, comprising:
A wireless device comprisinga semiconductor package, the semiconductor package comprising:
Dependencies are inferred from the claim text.