H10W 72/07632
Compression bonding
Official title: {Compression bonding, e.g. thermocompression bonding}
H10W72/07632 (Compression bonding) appears on 124 US grants and 163 published applications in this corpus.
Search patents in H10W- Granted patents
- 124
- Published applications
- 163
- Assignees
- 70
- Inventors
- 293
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 6 |
| 2005 | 3 | 4 |
| 2006 | 2 | 6 |
| 2007 | 4 | 3 |
| 2008 | 2 | 2 |
| 2009 | 3 | 11 |
| 2010 | 5 | 5 |
| 2011 | 4 | 8 |
| 2012 | 4 | 7 |
| 2013 | 8 | 9 |
| 2014 | 6 | 6 |
| 2015 | 8 | 8 |
| 2016 | 9 | 8 |
| 2017 | 9 | 12 |
| 2018 | 8 | 8 |
| 2019 | 8 | 8 |
| 2020 | 6 | 6 |
| 2021 | 4 | 12 |
| 2022 | 7 | 6 |
| 2023 | 6 | 9 |
| 2024 | 5 | 5 |
| 2025 | 6 | 8 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor manufacturing apparatus and method of manufacturing semiconductor device26 May 2026US 12,642,040 B2Mitsubishi Electric Corporation
- Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor17 Mar 2026US 12,581,983 B2Danfoss Silicon Power GmbH
- Roughened surface of a conductive wedge bonded ribbon encapsulated in a sermiconductor package10 Mar 2026US 12,575,468 B2STMicroelectronics S,r.l.
- Method of assembling semiconductor devices and corresponding semiconductor device23 Dec 2025US 12,506,053 B2STMicroelectronics S,r.l.
- Flex bonded integrated circuits7 Oct 2025US 12,438,114 B2Meta Platforms, Inc.
- Monolithic spring assemblies for high-frequency press-pack modules20 Aug 2026US 2026/0248017 A1
- Semiconductor manufacturing apparatus and method of manufacturing semiconductor device23 Jul 2026US 2026/0215207 A1Mitsubishi Electric Corporation
- Hybrid-material leads for solderless coupling of an electronic component28 May 2026US 2026/0150713 A1Semiconductor Components Industries, LLC
- Semiconductor devices and methods of manufacturing semiconductor devices14 May 2026US 2026/0136952 A1Amkor Technology Singapore Holding Pte.Ltd.
- Method of manufacturing a semiconductor device and corresponding semiconductor device and a semiconductor package30 Apr 2026US 2026/0123507 A1Nexperia B. V.
Most cited
By later US patents
- Semiconductor package and method for assembling the same35US 5,619,065 AGold Star Electron Co., Ltd. · 1997
- Semiconductor module, power conversion device, and method for manufacturing semiconductor module28US 9,418,975 B1Mitsubishi Electric Corporation · 2016
- Solderable contact regions22US 8,975,175 B1SunPower Corporation · 2015
- Stress clip design19US 6,075,286 AInternational Rectifier Corporation · 2000
- Ultrasonic chip removal method and apparatus18US 5,782,403 AInternational Business Machines Corporation · 1998