Method of assembling semiconductor devices and corresponding semiconductor device

A method, comprising:

• arranging on a die pad in a substrate at least one first semiconductor die with at least one electrically conductive ribbon extending on the at least one first semiconductor die wherein the at least one first semiconductor die lies intermediate the substrate and the at least one electrically conductive ribbon;
• and
• attaching at least one second semiconductor die on the at least one electrically conductive ribbon to provide on said die pad a stacked arrangement of the at least one second semiconductor die and the at least one first semiconductor die with the at least one electrically conductive ribbon intermediate the at least one first semiconductor die and the at least one second semiconductor die;
• wherein arranging comprises arranging a pair of electrically conductive ribbons to extend on the at least one first semiconductor die, wherein the first semiconductor die lies intermediate the substrate and said pair of electrically conductive ribbons;
• and
• wherein attaching comprises attaching the at least one second semiconductor die bridge-like across said electrically conductive ribbons in said pair of electrically conductive ribbons to provide a stacked arrangement of the at least one second semiconductor die, with each electrically conductive ribbon in the pair of electrically conductive ribbons intermediate said at least one first semiconductor die and the at least one second semiconductor die.

A device, comprising:

• a substrate comprising a die pad having arranged thereon at least one first semiconductor die with at least one electrically conductive ribbon extending on the at least one first semiconductor die wherein the at least one first semiconductor die lies intermediate the substrate and the at least one electrically conductive ribbon, and
• at least one second semiconductor die on the at least one electrically conductive ribbon to provide on said die pad a stacked arrangement of the at least one second semiconductor die and the at least one first semiconductor die with the at least one electrically conductive ribbon intermediate the at least one first semiconductor die and the at least one second semiconductor die;
• wherein said at least one electrically conductive ribbon comprises a pair of electrically conductive ribbons extending on the at least one first semiconductor die;
• wherein the at least one first semiconductor die lies intermediate the substrate and the pair of electrically conductive ribbons;
• and
• wherein said at least one second semiconductor die is attached bridge-like across said electrically conductive ribbons in said pair of electrically conductive ribbons to provide a stacked arrangement of the at least one second semiconductor die, with each electrically conductive ribbon in the pair of electrically conductive ribbons intermediate the at least one first semiconductor die and the at least one second semiconductor die.

A method, comprising:

• arranging on a die pad in a substrate at least one first semiconductor die with at least one electrically conductive ribbon extending on the at least one first semiconductor die wherein the at least one first semiconductor die lies intermediate the substrate and the at least one electrically conductive ribbon;
• and
• attaching at least one second semiconductor die on the at least one electrically conductive ribbon to provide on said die pad a stacked arrangement of the at least one second semiconductor die and the at least one first semiconductor die with the at least one electrically conductive ribbon intermediate the at least one first semiconductor die and the at least one second semiconductor die;
• wherein arranging comprises arranging on said substrate a pair of adjacent first semiconductor dice with a pair of electrically conductive ribbons, wherein each electrically conductive ribbon extends on one of the first semiconductor dice, wherein each one of the first semiconductor dice lies intermediate the substrate and a respective electrically conductive ribbon in the pair of electrically conductive ribbons;
• and
• wherein attaching comprises attaching the at least one second semiconductor die bridge-like across said electrically conductive ribbons in said pair of electrically conductive ribbons to provide a stacked arrangement of the at least one second semiconductor die, with each electrically conductive ribbon in the pair of electrically conductive ribbons intermediate a respective one of the first semiconductor dice and one end of the second semiconductor die.

A device, comprising:

• a substrate comprising a die pad having arranged thereon at least one first semiconductor die with at least one electrically conductive ribbon extending on the at least one first semiconductor die wherein the at least one first semiconductor die lies intermediate the substrate and the at least one electrically conductive ribbon, and
• at least one second semiconductor die on the at least one electrically conductive ribbon to provide on said die pad a stacked arrangement of the at least one second semiconductor die and the at least one first semiconductor die with the at least one electrically conductive ribbon intermediate the at least one first semiconductor die and the at least one second semiconductor die;
• wherein said at least one first semiconductor die comprises a pair of adjacent first semiconductor dice arranged on said substrate;
• wherein said at least one electrically conductive ribbon comprises a pair of electrically conductive ribbons, each electrically conductive ribbon extending on one of the first semiconductor dice;
• wherein each one of the first semiconductor dice lies intermediate the substrate and a respective electrically conductive ribbon in the pair of electrically conductive ribbons;
• and
• wherein said at least one second semiconductor die is attached bridge-like across said electrically conductive ribbons in said pair of electrically conductive ribbons to provide a stacked arrangement of the at least one second semiconductor die, with each electrically conductive ribbon in the pair of electrically conductive ribbons intermediate a respective one of the first semiconductor dice and one end of the second semiconductor die.