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US 6,075,286 AGranted
Stress clip design
AssigneeInternational Rectifier Corporation
InventorPeter R. Ewer
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a base plate, a semiconductor die having top and bottom surfaces, the bottom surface being mounted to the base plate, and a conductor tab having first and second ends, the first end being adapted to communicate with and couple to external circuitry, the second end including a relatively wide foot having a plurality of finger portions separated by gaps, the finger portions being mounted to an covering a substantial portion of the top surface of the semiconductor die.
Claims17
A semiconductor package, comprising:
- a base plate;
- a semiconductor die having top and bottom surfaces, the bottom surface being mounted to the base plate;
- and
- a conductor tab having first and second ends, the first end being adapted to communicate with and couple to external circuitry, the second end including a relatively wide foot having a plurality of finger portions separated by gaps, the finger portions being mounted to and covering a substantial portion of the top surface of the semiconductor die.
1 more element
A semiconductor package, comprising:
- a base plate;
- a semiconductor die having a length and width defining a die area and top and bottom surfaces, the bottom surface being mounted to the base plate;
- a conductor tab having a width substantially equal to or greater than the width of the semiconductor die, the conductor tab including:
- (i) one end having a foot adapted to mount to and cover a substantial portion of the top surface of the semiconductor die;
- (ii) a distal end being adapted to communicate with and couple to external circuitry;
- and (iii) a re-entrant bend disposed between the ends of the conductor tab;
- and
- an encapsulation material enclosing at least a portion of the base plate, the semiconductor die and the one end of the conductor tab, the re-entrant bend being external to the encapsulation.
5 more elements
Dependencies are inferred from the claim text.