Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
AssigneeMitsubishi Electric Corporation
InventorYusuke Yadani
Life of this patent
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Abstract
A semiconductor manufacturing apparatus includes a tool performing joining by ultrasonic vibration while applying a load to a metal terminal. The tool includes a plurality of protrusions arranged along the X-axis direction and the Y-axis direction on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal. The intervals between the plurality of protrusions are equal in the X direction of the pressing surface, and are larger on the inner peripheral side than on the outer peripheral side in the Y-axis direction of the pressing surface.
Claims9
A method of manufacturing a semiconductor device, comprising:
- performing joining by ultrasonic vibration while applying a load to a metal terminal with a tool, wherein
- the tool includes a plurality of protrusions arranged on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal along a first direction and a second direction that is a direction intersecting the first direction,
- intervals between the plurality of protrusions are equal in the first direction of the pressing surface,
- along a row of the plurality of protrusions in the second direction, a plurality of intervals between the plurality of protrusions on an inner peripheral side in the second direction are greater than an interval between the plurality of protrusions on an outer peripheral side of the pressing surface in the second direction,
- a protruding portion protruding toward the metal terminal is provided across one end portion of the pressing surface in the first direction, the protruding portion being positioned outside of the metal terminal in the first direction during the joining, and
- the protruding portion is configured to block a whisker from coming into contact with the semiconductor device during the joining.
A method of manufacturing a semiconductor device, comprising:
- performing joining by ultrasonic vibration while applying a load to a metal terminal with a tool, wherein
- the tool includes a plurality of protrusions arranged on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal along a first direction and a second direction that is a direction intersecting the first direction,
- intervals between the plurality of protrusions are equal in the first direction of the pressing surface,
- along a row of the plurality of protrusions in the second direction, a plurality of intervals between the plurality of protrusions on an inner peripheral side in the second direction are greater than an interval between the plurality of protrusions on an outer peripheral side of the pressing surface in the second direction,
- a protruding portion protruding toward the metal terminal is provided across one end portion of the pressing surface in the first direction, the protruding portion being positioned outside of the metal terminal in the first direction during the joining, and
- among the plurality of protrusions provided at both end portions in the second direction of the pressing surface, a groove on an outer peripheral side of the protrusions provided at both end portions in the first direction of the pressing surface is deeper than a groove between the protrusions provided at a portion other than the both end portions in the first direction of the pressing surface.
Dependencies are inferred from the claim text.