Ultrasonic chip removal method and apparatus
AssigneeInternational Business Machines Corporation
InventorLi Wang
Life of this patent
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Abstract
A device for removal of a semiconductor chip interconnected to a substrate package via solder ball connections, for instance, includes an ultrasonic transducer for providing lateral ultrasonic vibration. A converter is coupled between the ultrasonic transducer and semiconductor chip for converting the lateral ultrasonic vibration to a torsional ultrasonic vibration, wherein the torsional ultrasonic vibration is perpendicular to the lateral ultrasonic vibration. The lateral-to-torsional converter further applies the torsional ultrasonic vibration to the chip for facilitating its removal from the substrate package. A method for removal of a semiconductor chip interconnected to a substrate package is also disclosed.
Claims20
A method for removal of a semiconductor chip interconnected to a substrate package via solder ball connections, said method comprising the steps of:
- providing lateral ultrasonic vibration with the use of an ultrasonic transducer;
- and
- converting the lateral ultrasonic vibration to a torsional ultrasonic vibration with the use of a lateral-to-torsional ultrasonic vibration converter, the torsional ultrasonic vibration being perpendicular to the lateral ultrasonic vibration;
- and
- applying the torsional ultrasonic vibration to the chip for facilitating its removal from the substrate package, wherein the semiconductor chip is coupled to the lateral-to-torsional ultrasonic vibration converter.
Apparatus for ultrasonic torsional cycling of a component part interconnected to a substrate package, said apparatus comprising:
- means for securing the substrate package;
- an ultrasonic transducer;
- power supply for controllably energizing said ultrasonic transducer, wherein upon an energization, said ultrasonic transducer provides lateral ultrasonic vibration;
- means coupled between said ultrasonic transducer and the component part for converting the lateral ultrasonic vibration to a torsional ultrasonic vibration, said lateral-to-torsional converter means further for applying torsional ultrasonic vibration to the component part perpendicular to the lateral ultrasonic vibration;
- and
- means for controlling said power supply to energize said ultrasonic transducer, wherein the torsional ultrasonic vibration facilitates a desired torsional cycling of the component part on the substrate package.
Apparatus for removal of a semiconductor chip interconnected to a substrate package, said apparatus comprising:
- an ultrasonic transducer for providing lateral ultrasonic vibration;
- and
- means coupled between said ultrasonic transducer and the semiconductor chip for converting the lateral ultrasonic vibration to a torsional ultrasonic vibration, the torsional ultrasonic vibration being perpendicular to the lateral ultrasonic vibration, said lateral-to-torsional converter means further for applying the torsional ultrasonic vibration to the chip for facilitating its removal from the substrate package.
Dependencies are inferred from the claim text.