H10W 72/075
Of bond wires
Official title: {of bond wires}
H10W72/075 (Of bond wires) appears on 17,594 US grants and 17,575 published applications in this corpus.
Search patents in H10W- Granted patents
- 17,594
- Published applications
- 17,575
- Assignees
- 2,478
- Inventors
- 23,260
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 25 | 0 |
| 1977 | 22 | 0 |
| 1978 | 15 | 0 |
| 1979 | 14 | 0 |
| 1980 | 10 | 0 |
| 1981 | 8 | 0 |
| 1982 | 23 | 0 |
| 1983 | 21 | 0 |
| 1984 | 25 | 0 |
| 1985 | 30 | 0 |
| 1986 | 32 | 0 |
| 1987 | 43 | 0 |
| 1988 | 44 | 0 |
| 1989 | 59 | 0 |
| 1990 | 53 | 0 |
| 1991 | 92 | 0 |
| 1992 | 103 | 0 |
| 1993 | 107 | 0 |
| 1994 | 134 | 0 |
| 1995 | 136 | 0 |
| 1996 | 156 | 0 |
| 1997 | 193 | 0 |
| 1998 | 249 | 0 |
| 1999 | 298 | 0 |
| 2000 | 423 | 0 |
| 2001 | 535 | 314 |
| 2002 | 636 | 876 |
| 2003 | 724 | 827 |
| 2004 | 758 | 852 |
| 2005 | 615 | 796 |
| 2006 | 598 | 761 |
| 2007 | 529 | 797 |
| 2008 | 443 | 802 |
| 2009 | 487 | 769 |
| 2010 | 627 | 824 |
| 2011 | 688 | 823 |
| 2012 | 720 | 768 |
| 2013 | 729 | 746 |
| 2014 | 752 | 762 |
| 2015 | 756 | 860 |
| 2016 | 785 | 745 |
| 2017 | 709 | 682 |
| 2018 | 629 | 626 |
| 2019 | 588 | 580 |
| 2020 | 565 | 654 |
| 2021 | 483 | 571 |
| 2022 | 486 | 645 |
| 2023 | 442 | 473 |
| 2024 | 417 | 479 |
| 2025 | 348 | 333 |
| 2026 | 230 | 210 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices29 Sep 2026US 12,751,297 B2Infineon Technologies Austria AG
- Semiconductor device29 Sep 2026US 12,751,333 B2Rohm Co., Ltd.
- Semiconductor package15 Sep 2026US 12,740,482 B2Samsung Electronics Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Method of manufacturing semiconductor device8 Oct 2026US 2026/0314432 A1Renesas Electronics Corporation
- Connecting semiconductor dies through traces8 Oct 2026US 2026/0314460 A1Micron Technology, Inc.
- Semiconductor package having a multi-layer film structure8 Oct 2026US 2026/0314477 A1SanDisk Technologies LLC
Most cited
By later US patents
- Implantable microstimulator1,104US 5,193,539 AAlfred E. Mann Foundation for Scientific Research · 1993
- Implantable microstimulator841US 5,324,316 AAlfred E. Mann Foundation for Scientific Research · 1994
- Multiple encapsulation of phosphor-LED devices773US 5,959,316 AHewlett-Packard Company · 1999
- Wavelength-converting casting composition and its use749US 6,066,861 ASiemens Aktiengesellschaft · 2000
- Method for fabricating stackable chip scale semiconductor package676US 6,235,554 B1Micron Technology, Inc. · 2001