H10W 72/07551
Characterised by changes in properties of the bond wires during the connecting
Official title: {characterised by changes in properties of the bond wires during the connecting}
H10W72/07551 (Characterised by changes in properties of the bond wires during the connecting) appears on 6,897 US grants and 6,943 published applications in this corpus.
Search patents in H10W- Granted patents
- 6,897
- Published applications
- 6,943
- Assignees
- 1,359
- Inventors
- 10,770
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 6 | 0 |
| 1978 | 5 | 0 |
| 1979 | 5 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 10 | 0 |
| 1984 | 5 | 0 |
| 1985 | 11 | 0 |
| 1986 | 7 | 0 |
| 1987 | 20 | 0 |
| 1988 | 9 | 0 |
| 1989 | 23 | 0 |
| 1990 | 17 | 0 |
| 1991 | 33 | 0 |
| 1992 | 39 | 0 |
| 1993 | 36 | 0 |
| 1994 | 48 | 0 |
| 1995 | 61 | 0 |
| 1996 | 73 | 0 |
| 1997 | 89 | 0 |
| 1998 | 109 | 0 |
| 1999 | 115 | 0 |
| 2000 | 131 | 0 |
| 2001 | 157 | 69 |
| 2002 | 154 | 234 |
| 2003 | 175 | 214 |
| 2004 | 199 | 214 |
| 2005 | 170 | 284 |
| 2006 | 202 | 272 |
| 2007 | 185 | 323 |
| 2008 | 164 | 311 |
| 2009 | 197 | 329 |
| 2010 | 245 | 355 |
| 2011 | 300 | 305 |
| 2012 | 314 | 357 |
| 2013 | 291 | 345 |
| 2014 | 345 | 334 |
| 2015 | 336 | 377 |
| 2016 | 351 | 326 |
| 2017 | 336 | 310 |
| 2018 | 293 | 287 |
| 2019 | 298 | 266 |
| 2020 | 244 | 275 |
| 2021 | 208 | 222 |
| 2022 | 216 | 274 |
| 2023 | 181 | 237 |
| 2024 | 183 | 205 |
| 2025 | 168 | 133 |
| 2026 | 118 | 85 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices29 Sep 2026US 12,751,297 B2Infineon Technologies Austria AG
- Semiconductor device29 Sep 2026US 12,751,333 B2Rohm Co., Ltd.
- Semiconductor package15 Sep 2026US 12,740,482 B2Samsung Electronics Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Connecting semiconductor dies through traces8 Oct 2026US 2026/0314460 A1Micron Technology, Inc.
- Semiconductor package having a multi-layer film structure8 Oct 2026US 2026/0314477 A1SanDisk Technologies LLC
- Semiconductor devices having aligned front-end interface contacts and back-end interface contacts, and associated systems and methods8 Oct 2026US 2026/0314488 A1Micron Technology, Inc.
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Implantable microstimulator1,104US 5,193,539 AAlfred E. Mann Foundation for Scientific Research · 1993
- Implantable microstimulator841US 5,324,316 AAlfred E. Mann Foundation for Scientific Research · 1994
- Wavelength-converting casting composition and its use749US 6,066,861 ASiemens Aktiengesellschaft · 2000
- Methods for manufacturing a semiconductor package having a sacrificial layer553US 6,001,671 ATessera, Inc. · 1999
- Nitride semiconductor light emitting device and method for manufacturing the same497US 7,319,044 B2Samsung Electro-Mechanics Co., Ltd. · 2008