H10W 72/07555
Changes in materials
Official title: {changes in materials}
H10W72/07555 (Changes in materials) appears on 286 US grants and 298 published applications in this corpus.
Search patents in H10W- Granted patents
- 286
- Published applications
- 298
- Assignees
- 122
- Inventors
- 543
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 6 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 7 | 0 |
| 2001 | 5 | 1 |
| 2002 | 1 | 8 |
| 2003 | 5 | 4 |
| 2004 | 4 | 4 |
| 2005 | 2 | 10 |
| 2006 | 7 | 11 |
| 2007 | 7 | 8 |
| 2008 | 6 | 11 |
| 2009 | 9 | 9 |
| 2010 | 4 | 10 |
| 2011 | 12 | 11 |
| 2012 | 12 | 16 |
| 2013 | 11 | 19 |
| 2014 | 10 | 18 |
| 2015 | 12 | 12 |
| 2016 | 19 | 17 |
| 2017 | 21 | 22 |
| 2018 | 18 | 17 |
| 2019 | 16 | 15 |
| 2020 | 16 | 18 |
| 2021 | 12 | 10 |
| 2022 | 13 | 19 |
| 2023 | 11 | 15 |
| 2024 | 13 | 6 |
| 2025 | 8 | 4 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power electronics arrangement with parallel connected semiconductor switches, power electronics device, motor vehicle, and method for producing a power electronics arrangement8 Sep 2026US 12,733,550 B2Audi AG
- Transistor device, semiconductor package and method of fabricating a transistor device18 Aug 2026US 12,713,671 B2Infineon Technologies Austria AG
- Semiconductor device package comprising a plurality of leads wherein a first lead has a pad surface larger than a second lead6 Jan 2026US 12,519,040 B2Rohm Co., Ltd.
- Semiconductor device2 Dec 2025US 12,489,047 B2Rohm Co., Ltd.
- Semiconductor package substrate with groove on die pad18 Nov 2025US 12,476,204 B2Texas Instruments Incorporated
- Capillary head with noncircular cone for wirebonding in semiconductor package manufacturing27 Aug 2026US 2026/0256014 A1
- Copper alloy bonding wire for semiconductor devices9 Apr 2026US 2026/0097454 A1Nippon Micrometal Corporation
- Semiconductor device19 Feb 2026US 2026/0053029 A1Rohm Co., Ltd.
- Electronic component and device including the electronic component5 Jun 2025US 2025/0183220 A1Canon Kabushiki Kaisha
- Semiconductor device and method for fabricating the same3 Apr 2025US 2025/0112184 A1United Microelectronics Corp.
Most cited
By later US patents
- Ion-sensitive electrode and processes for making the same162US 4,133,735 AThe Board of Regents of the University of Washington · 1979
- Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture138US 7,067,911 B1Bridge Semiconductor Corporation · 2006
- Semiconductor chip assembly with embedded metal particle130US 7,009,297 B1Bridge Semiconductor Corporation · 2006
- Method of improving copper interconnects of semiconductor devices for bonding109US 6,544,880 B1Micron Technology, Inc. · 2003
- Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond81US 7,268,421 B1Bridge Semiconductor Corporation · 2007