Ion-sensitive electrode and processes for making the same
AssigneeThe Board of Regents of the University of Washington
InventorsMartin A. Afromowitz, Sinclair S. Yee
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AssigneeThe Board of Regents of the University of Washington
InventorsMartin A. Afromowitz, Sinclair S. Yee
Estimating the term…
An improved ion-sensitive electrode is described, particularly in terms of the structure of a pH electrode and first and second processes for making the same. The pH electrode includes a substrate, preferably of forsterite, which is configured as a wafer having a substantially planar wafer surface. A continuous conducting layer, formed by either thin-film vapor deposition or thick-film screening processes, is formed on the substantially planar wafer surface in a desired configuration. A first region of the continuous conducting layer, and contiguous portions of the substantially planar wafer surface, are covered by a continuous membrane layer preferably composed of a pH-sensitive glass such as Corning Code 0150 glass. Typically, the membrane layer is formed by a thick-film process which involves the reduction of the glass to a fine powder, the mixing of the powder with an organic vehicle including an organic solvent and an organic binder to form a glass paste, and the application of the glass paste to the wafer through a wire mesh screen having an open region therethrough corresponding in configuration to that of the desired membrane layer. The paste when applied to the wafer is fused into a continuous membrane layer by the application of heat, at a first temperature to drive off the organic solvent and at a second temperature or temperatures to drive off the organic binder and to fuse the glass. An insulated output lead is connected directly to a second region of the conducting layer. Alternatively, an active device chip, such as that including a field effect transistor, is bonded to the wafer and interconnected with the second region of the conducting layer and with the output lead or leads. The exposed conducting elements of the electrode, including the second region of the conducting layer, the active device chip, and all exposed portions of the leads, are covered by a fluid-tight seal. Other ion-sensitive electrodes and variations of the aforementioned processes are described.
An improved ion-sensitive electrode comprising:
A process for fabricating an ion-sensitive electrode, said process comprising the steps of:
A process for fabricating a pH electrode, said process comprising the steps of:
A process for fabricating an ion-sensitive electrode, said process comprising the steps of:
An improved ion-sensitive electrode comprising:
A process for fabricating an ion-sensitive electrode, said process comprising the steps of:
Dependencies are inferred from the claim text.