Semiconductor package substrate with groove on die pad
AssigneeTexas Instruments Incorporated
InventorsChienHao Wang, Bob Lee, YuhHarng Chien
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Abstract
A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.
Claims18
A semiconductor package, comprising:
- a metallic pad and a lead spaced from the metallic pad by a gap;
- a semiconductor die;
- and
- an adhesive between the metallic pad and the semiconductor die, wherein the metallic pad includes a groove around the semiconductor die, wherein the metallic pad has a first surface roughness outside the groove and a second surface roughness inside the groove, and wherein the first surface roughness is greater than the second surface roughness.
A method for fabricating a semiconductor package, comprising:
- applying an adhesive to a surface of a metallic pad inside of a perimeter formed by a groove on the surface of the metallic pad, wherein the semiconductor package further includes a lead spaced from the metallic pad by a gap;
- positioning a semiconductor die on the metallic pad in contact with the adhesive such that the groove is around the semiconductor die;
- and
- curing the adhesive, wherein the metallic pad has a first surface roughness outside the groove and a second surface roughness inside the groove, and wherein the first surface roughness is greater than the second surface roughness.
Dependencies are inferred from the claim text.