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US 2026/0053029 A1Published application
Semiconductor device
AssigneeRohm Co., Ltd.
InventorHideo HARA
Life of this patent
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Abstract
A semiconductor device includes a substrate, a conductive part formed on a front surface of the substrate, a semiconductor chip disposed on the front surface of the substrate, a control unit that controls the semiconductor chip, a sealing resin that covers the semiconductor chip, the control unit and the conductive part, and a first lead bonded to the conductive part and partially exposed from the sealing resin. The conductive part includes a first pad and a second pad disposed apart from each other. The first lead is bonded to the first pad and the second pad.
Claims18
A substrate unit used for a semiconductor device, comprising:
- a substrate having a substrate front surface and a substrate back surface facing away from each other in a thickness direction;
- a conductive part made of an electrically conductive material and formed on the substrate front surface, the conductive part including a first pad and a second pad that are spaced apart from each other;
- a first electronic component and a second electronic component that are disposed on the substrate front surface;
- a conductive bonding material;
- and
- a first lead bonded to the conductive part via the conductive bonding material and including a portion protruding from an edge of the substrate as viewed in the thickness direction,
- wherein the first lead is conductively bonded to the first pad and the second pad in a manner bridging between the first pad and the second pad.
4 more elements
Dependencies are inferred from the claim text.