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US 7,268,421 B1Granted
Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond
AssigneeBridge Semiconductor Corporation
InventorCharles W. C. Lin
Life of this patent
Estimating the term…
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, and the metal pillar is welded to the routing line.
Claims100
A semiconductor chip assembly, comprising:
- a semiconductor chip that includes first and second opposing surfaces, wherein the first surface of the chip includes a conductive pad;
- a conductive trace that includes a routing line and a metal pillar, wherein the metal pillar includes a ball bond that is welded to the routing line;
- a connection joint that electrically connects the routing line and the pad;
- and
- an encapsulant that includes first and second opposing surfaces, wherein the first surface of encapsulant faces in a first direction, the second surface of the encapsulant faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in the encapsulant, the chip, the metal pillar and the encapsulant extend vertically beyond the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, the metal pillar is disposed outside a periphery of the chip and the ball bond extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip and extends vertically and laterally across most or all of the metal pillar.
2 more elements
A semiconductor chip assembly, comprising:
- a semiconductor chip that includes first and second opposing surfaces, wherein the first surface of the chip includes a conductive pad;
- a conductive trace that includes a routing line and a metal pillar, wherein the metal pillar is a ball bond that is welded to the routing line;
- a connection joint that electrically connects the routing line and the pad;
- and
- an encapsulant that includes first and second opposing surfaces, wherein the first surface of encapsulant faces in a first direction, the second surface of the encapsulant faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in the encapsulant, the chip, the metal pillar and the encapsulant extend vertically beyond the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, and the metal pillar is disposed outside a periphery of the chip, extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip and extends laterally at least the thickness of the chip.
2 more elements
A semiconductor chip assembly, comprising:
- a semiconductor chip that includes first and second opposing surfaces, wherein the first surface of the chip includes a conductive pad;
- a conductive trace that includes a routing line and a metal pillar, wherein the metal pillar is a ball bond that is welded to the routing line;
- a connection joint that electrically connects the routing line and the pad;
- and
- an encapsulant that includes first and second opposing surfaces, wherein the first surface of encapsulant faces in a first direction, the second surface of the encapsulant faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in and contact the encapsulant, the chip, the metal pillar and the encapsulant extend vertically beyond the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, and the metal pillar is disposed outside a periphery of the chip, extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip, extends laterally at least the thickness of the chip and is laterally aligned with the first surface of the encapsulant.
2 more elements
A method of making a semiconductor chip assembly, comprising:
- providing a routing line;
- then
- mechanically attaching a semiconductor chip to the routing line, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
- forming a connection joint that electrically connects the routing line and the pad;
- welding a metal pillar to and only to the routing line, wherein the metal pillar includes a ball bond that is welded to the routing line;
- and
- forming an encapsulant after attaching the chip to the routing line and welding the metal pillar to the routing line, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in the encapsulant, the chip, the metal pillar and the routing line extend vertically beyond the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, the metal pillar is disposed outside a periphery of the chip and the ball bond extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip and extends vertically and laterally across most or all of the metal pillar.
4 more elements
A method of making a semiconductor chip assembly, comprising:
- providing a routing line;
- then
- mechanically attaching a semiconductor chip to the routing line, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
- forming a connection joint that electrically connects the routing line and the pad;
- welding a metal pillar to and only to the routing line, wherein the metal pillar is a stud bump with a ball bond and a stump, the ball bond is welded to the routing line and the stump extends vertically from the ball bond and is spaced from the routing line;
- forming an encapsulant after attaching the chip to the routing line and welding the metal pillar to the routing line, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in the encapsulant, the encapsulant covers and extends vertically beyond the chip, the routing line and the metal pillar in the first direction, the chip and the metal pillar extend vertically beyond the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, the metal pillar is disposed outside a periphery of the chip and the ball bond extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip and extends laterally at least the thickness of the chip;
- and
- removing a portion of the encapsulant by grinding the encapsulant and then grinding the encapsulant and the metal pillar such that the stump is removed and the ball bond is laterally aligned with the first surface of the encapsulant and exposed.
5 more elements
A method of making a semiconductor chip assembly, comprising:
- providing a routing line;
- then
- mechanically attaching a semiconductor chip to the routing line, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
- forming a connection joint that electrically connects the routing line and the pad;
- welding a metal pillar to and only to the routing line by ball bonding using a capillary that presses a wire ball against the routing line, wherein the metal pillar is a stud bump with a ball bond and a stump, the ball bond is welded to the routing line and the stump extends vertically from the ball bond and is spaced from the routing line;
- forming an encapsulant after attaching the chip to the routing line and welding the metal pillar to the routing line, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in the encapsulant, the encapsulant covers and extends vertically beyond the chip, the routing line and the metal pillar in the first direction, the chip and the metal pillar extend vertically beyond the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, the metal pillar is disposed outside a periphery of the chip and the ball bond extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip and extends laterally at least the thickness of the chip;
- and
- removing a portion of the encapsulant by grinding the encapsulant and then grinding the encapsulant and the metal pillar such that the stump is removed and the ball bond is laterally aligned with the first surface of the encapsulant and exposed.
5 more elements
Dependencies are inferred from the claim text.