A semiconductor device, comprising:
- a semiconductor element having an element main surface and an element back surface spaced apart from each other in a thickness direction and including a plurality of main surface electrodes arranged on the element main surface;
- a die pad on which the semiconductor element is mounted;
- a plurality of leads including at least one first lead and at least one second lead and arranged around the die pad when viewed in the thickness direction;
- a plurality of connecting members including a first connecting member and a second connecting member and configured to electrically connect the plurality of main surface electrodes and the plurality of leads;
- a resin member configured to seal the semiconductor element, a part of the die pad, parts of the plurality of leads, and the plurality of connecting members and having a rectangular shape when viewed in the thickness direction;
- and
- a plurality of third leads extending from an outer edge of the die pad toward an outer edge of the resin member when viewed in the thickness direction,
- wherein each of the plurality of leads is configured to entirely overlap with the resin member when viewed in the thickness direction and arranged along an outer edge of the resin member when viewed in the thickness direction,
- wherein the at least one first lead has a first pad surface to which the first connecting member is bonded,
- wherein the at least one second lead has a second pad surface to which the second connecting member is bonded,
- wherein the first pad surface is larger than the second pad surface when viewed in the thickness direction,
- wherein the die pad has a rectangular shape when viewed in the thickness direction,
- wherein the plurality of third leads extends from four corners of the die pad when viewed in the thickness direction,
- wherein the at least one first lead is formed with a notch that is formed along an adjacent third lead among the plurality of third leads when viewed in the thickness direction,
- wherein the first pad surface has:
- a first end edge that overlaps with the outer edge of the resin member when viewed in the thickness direction;
- a third end edge extending from the first end edge toward the die pad while being orthogonal to the first end edge when viewed in the thickness direction;
- a fifth end edge that is formed by the notch;
- and
- a sixth end edge that is formed between the third end edge and the fifth end edge and is parallel to the first end edge when viewed in the thickness direction,
- wherein the first end edge is longer than the third end edge, and
- wherein the sixth end edge is longer than the third end edge.