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US 12,489,047 B2Granted
Semiconductor device
AssigneeRohm Co., Ltd.
InventorHideo Hara
Life of this patent
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Abstract
A semiconductor device includes a substrate, a conductive part formed on a front surface of the substrate, a semiconductor chip disposed on the front surface of the substrate, a control unit that controls the semiconductor chip, a sealing resin that covers the semiconductor chip, the control unit and the conductive part, and a first lead bonded to the conductive part and partially exposed from the sealing resin. The conductive part includes a first pad and a second pad disposed apart from each other. The first lead is bonded to the first pad and the second pad.
Claims18
A semiconductor device comprising:
- a substrate having a substrate front surface and a substrate back surface facing away from each other in a thickness direction;
- a conductive part made of an electrically conductive material and formed on the substrate front surface;
- a semiconductor chip disposed on the substrate front surface;
- a control unit that is disposed on the substrate front surface and controls the semiconductor chip;
- a sealing resin that covers the semiconductor chip, the control unit, the conductive part and at least a portion of the substrate;
- a conductive bonding material;
- and
- a first lead bonded to the conductive part via the conductive bonding material and partially exposed from the sealing resin, wherein
- the conductive part includes a first pad and a second pad disposed apart from each other, and
- the first lead is bonded to the first pad and the second pad.
7 more elements
Dependencies are inferred from the claim text.