H10W 72/07554
Changes in dispositions
Official title: {changes in dispositions}
H10W72/07554 (Changes in dispositions) appears on 4,724 US grants and 4,661 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,724
- Published applications
- 4,661
- Assignees
- 1,048
- Inventors
- 7,830
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 4 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 6 | 0 |
| 1984 | 2 | 0 |
| 1985 | 7 | 0 |
| 1986 | 5 | 0 |
| 1987 | 15 | 0 |
| 1988 | 5 | 0 |
| 1989 | 12 | 0 |
| 1990 | 13 | 0 |
| 1991 | 25 | 0 |
| 1992 | 25 | 0 |
| 1993 | 27 | 0 |
| 1994 | 36 | 0 |
| 1995 | 48 | 0 |
| 1996 | 58 | 0 |
| 1997 | 72 | 0 |
| 1998 | 90 | 0 |
| 1999 | 90 | 0 |
| 2000 | 89 | 0 |
| 2001 | 110 | 52 |
| 2002 | 113 | 172 |
| 2003 | 132 | 146 |
| 2004 | 145 | 154 |
| 2005 | 122 | 201 |
| 2006 | 146 | 191 |
| 2007 | 129 | 206 |
| 2008 | 105 | 203 |
| 2009 | 122 | 224 |
| 2010 | 163 | 245 |
| 2011 | 204 | 225 |
| 2012 | 216 | 239 |
| 2013 | 209 | 236 |
| 2014 | 239 | 219 |
| 2015 | 232 | 282 |
| 2016 | 236 | 221 |
| 2017 | 227 | 208 |
| 2018 | 185 | 174 |
| 2019 | 196 | 172 |
| 2020 | 151 | 179 |
| 2021 | 132 | 150 |
| 2022 | 142 | 174 |
| 2023 | 131 | 143 |
| 2024 | 116 | 136 |
| 2025 | 105 | 72 |
| 2026 | 71 | 37 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices29 Sep 2026US 12,751,297 B2Infineon Technologies Austria AG
- Semiconductor device29 Sep 2026US 12,751,333 B2Rohm Co., Ltd.
- Semiconductor package15 Sep 2026US 12,740,482 B2Samsung Electronics Co., Ltd.
- Semiconductor device having chip capacitor connected to semiconductor chip with wires8 Sep 2026US 12,733,183 B2Renesas Electronics Corporation
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
- Electronic package and shielding part including semiconductor block and magnetized layer24 Sep 2026US 2026/0293688 A1Siliconware Precision Industries Co., Ltd.
- Electronic package and shielding part including semiconductor block and magnetized layer17 Sep 2026US 2026/0282930 A1Siliconware Precision Industries Co., Ltd.
- Radio frequency (rf) interconnect configuration for substrate and surface mount device27 Aug 2026US 2026/0255997 A1Ciena Corporation
Most cited
By later US patents
- Implantable microstimulator1,104US 5,193,539 AAlfred E. Mann Foundation for Scientific Research · 1993
- Implantable microstimulator841US 5,324,316 AAlfred E. Mann Foundation for Scientific Research · 1994
- Wavelength-converting casting composition and its use749US 6,066,861 ASiemens Aktiengesellschaft · 2000
- Methods for manufacturing a semiconductor package having a sacrificial layer553US 6,001,671 ATessera, Inc. · 1999
- Nitride semiconductor light emitting device and method for manufacturing the same497US 7,319,044 B2Samsung Electro-Mechanics Co., Ltd. · 2008