Semiconductor device

A semiconductor device comprising:

• a first semiconductor element;
• a second semiconductor element;
• an insulating element including a first coil and a third insulating layer;
• a second coil magnetically coupled to the first coil;
• and a support substrate on which the first semiconductor element and the second semiconductor element are mounted,
• wherein the support substrate includes an insulating base member, and a substrate wiring formed on the base member,
• the substrate wiring includes a first wiring member electrically interposed between the first semiconductor element and the first coil, and a second wiring member electrically interposed between the second semiconductor element and the second coil,
• the second coil is arranged between the first coil and the base member,
• the insulating element is supported by the support substrate,
• the insulating element has a third element obverse surface and a third element reverse surface that face away from each other in a thickness direction of the support substrate,
• the insulating element includes a fourth pad connected to the second coil,
• the fourth pad and the third insulating layer are exposed from the third element reverse surface, and
• the insulating element and the support substrate are such that the fourth pad and the second wiring member are directly joined to each other, and the third insulating layer and the base member are directly joined to each other.