US 2026/0255997 A1 · RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND SURFACE MOUNT DEVICE

Abstract

Aspects of the subject disclosure may include, for example, system, comprising a substrate having an interconnect in or on a surface of the substrate, a riser disposed over the surface, the riser being configured with one or more through riser vias for coupling to the interconnect, a device positioned over the surface, the device having one or more conductive contacts residing in a plane of the device, and one or more wire bonds coupling the one or more through riser vias with the one or more conductive contacts thereby enabling connectivity of the interconnect to be raised toward or to the plane of the device such that at least one of the one or more wire bonds has a limited physical length. Other embodiments are disclosed.

Claims20

Dependent claims

A riser, comprising:

one or more through riser vias configured for coupling to an interconnect that is in or on a surface of a substrate when the riser is positioned over the surface and partially over the interconnect;
a driver having a driver input coupled to the one or more through riser vias and a driver output;
and
a redistribution layer coupled to the driver output and configured for coupling to one or more wire bonds.

1 more element

A method, comprising:

providing one or more through riser vias in a riser;
mounting the riser with respect to a substrate such that the riser is positioned over a surface of the substrate and is partially over an interconnect that is in or on a surface of the substrate,
providing a driver having a driver input coupled to the one or more through riser vias and a driver output;
and
providing a redistribution layer coupled to the driver output and configured for coupling to one or more wire bonds.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

19/649,641Filed 16 Apr 2026

Priority

3 Mar 2023

Published

27 Aug 2026

Term ends

Not estimatedThe source records don’t support an estimate.

Classification20 codes

H10W 70/635
Vias, e.g. via plugs: through-vias
H10W 20/023
Of interconnections within wafers or substrates: the interconnections being through-semiconductor vias
H10W 20/20
Interconnections in chips, wafers or substrates: interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
H10W 70/095
Of insulating or insulated package substrates, or of interposers, or of redistribution layers: of vias therein

Radio frequency (rf) interconnect configuration for substrate and surface mount device

Life of this patent

Radio frequency (rf) interconnect configuration for substrate and surface mount device

Life of this patent

Abstract

Claims20