H10W 72/07552
Changes in structures or sizes
Official title: {changes in structures or sizes}
H10W72/07552 (Changes in structures or sizes) appears on 1,249 US grants and 1,411 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,249
- Published applications
- 1,411
- Assignees
- 343
- Inventors
- 2,137
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 5 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 12 | 0 |
| 1998 | 10 | 0 |
| 1999 | 6 | 0 |
| 2000 | 10 | 0 |
| 2001 | 13 | 9 |
| 2002 | 17 | 22 |
| 2003 | 13 | 28 |
| 2004 | 26 | 23 |
| 2005 | 20 | 39 |
| 2006 | 23 | 46 |
| 2007 | 22 | 46 |
| 2008 | 31 | 54 |
| 2009 | 37 | 46 |
| 2010 | 39 | 49 |
| 2011 | 41 | 41 |
| 2012 | 52 | 66 |
| 2013 | 55 | 68 |
| 2014 | 60 | 79 |
| 2015 | 62 | 67 |
| 2016 | 77 | 66 |
| 2017 | 76 | 85 |
| 2018 | 66 | 60 |
| 2019 | 65 | 53 |
| 2020 | 58 | 69 |
| 2021 | 43 | 66 |
| 2022 | 59 | 81 |
| 2023 | 44 | 95 |
| 2024 | 62 | 68 |
| 2025 | 65 | 48 |
| 2026 | 49 | 37 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Power electronics arrangement with parallel connected semiconductor switches, power electronics device, motor vehicle, and method for producing a power electronics arrangement8 Sep 2026US 12,733,550 B2Audi AG
- Semiconductor package25 Aug 2026US 12,720,773 B2Samsung Electronics Co., Ltd.
- Imaging element package, method of manufacturing the same, and electronic device25 Aug 2026US 12,720,878 B2Sony Semiconductor Solutions Corporation
- Semiconductor package or a printed circuit board, both modified to one or more of reduce, inverse or utilize magnetic coupling caused by the load current of a semiconductor transistor25 Aug 2026US 12,721,186 B2Infineon Technologies Austria AG
- Connecting semiconductor dies through traces8 Oct 2026US 2026/0314460 A1Micron Technology, Inc.
- Semiconductor devices having aligned front-end interface contacts and back-end interface contacts, and associated systems and methods8 Oct 2026US 2026/0314488 A1Micron Technology, Inc.
- Power module package with molded via and dual side press-fit pin1 Oct 2026US 2026/0305495 A1Semiconductor Components Industries, LLC
- Semiconductor device24 Sep 2026US 2026/0293686 A1Rohm Co., Ltd.
- Semiconductor package10 Sep 2026US 2026/0271790 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Plural semiconductor die housed in common package with split heat sink266US 5,977,630 AInternational Rectifier Corporation · 1999
- Semiconductor device and method for manufacturing the same266US 6,307,272 B1Hitachi, Ltd. · 2001
- Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding240US 5,468,999 AMotorola, Inc. · 1995
- Integrated sensor199US 7,259,545 B2Allegro MicroSystems, LLC · 2007