Imaging element package, method of manufacturing the same, and electronic device

A method of manufacturing an imaging element package including a solid-state imaging element having a first pad, a substrate on which the solid-state imaging element is mounted, the substrate having a second pad, an insulating layer provided on a surface of the solid-state imaging element above the first pad, and a wire wiring that connects the first pad and the second pad by a metal wire, the method comprising:

• bonding a ball portion to the first pad, the ball portion having a thickness equal to or greater than a depth of an opening exposing the first pad in the solid-state imaging element, and being disposed without overlapping end portions of the insulating layer defining the opening;
• and
• connecting a crescent portion at an end of the metal wire bonded to the ball portion, the crescent portion being connected to the ball portion over a connection length,
• wherein the depth of the opening is approximately 8 μm or more.

An electronic device, comprising:

• an optical system;
• an imaging element package that receives light from the optical system,
• wherein the imaging element package comprises:
• a solid-state imaging element having a first pad;
• a substrate on which the solid-state imaging element is mounted, the substrate having a second pad;
• an insulating layer provided on a surface of the solid-state imaging element above the first pad;
• and
• a wire wiring that connects the first pad and the second pad by a metal wire,
• wherein the wire wiring includes:
• a ball portion bonded to the first pad, the ball portion having a thickness equal to or greater than a depth of an opening exposing the first pad in the solid-state imaging element, and being disposed without overlapping end portions of the insulating layer defining the opening;
• and
• a crescent portion at an end of the metal wire bonded to the ball portion, the crescent portion being connected to the metal wire over a connection length, and
• wherein the depth of the opening is approximately 8 μm or more;
• and
• a digital signal processor that processes signals received from the imaging element package.