Semiconductor package having a multi-layer film structure

A method of manufacturing a semiconductor package, comprising:

• disposing a plurality of stacked semiconductor dies on a substrate, the plurality of stacked semiconductor dies including:
• a top semiconductor die positioned above the substrate, the top semiconductor die including a top surface;
• and
• a semiconductor die contact formed on the top surface;
• connecting a portion of a bond wire to the semiconductor die contact of the top semiconductor die;
• and
• disposing a multi-layer film structure directly over the top semiconductor die of the plurality of stacked semiconductor dies, an insulative layer of the multi-layer film structure contacting the portion of the bond wire connected to the semiconductor die contact of the top semiconductor die.

An encapsulated semiconductor package, comprising:

• a substrate including a first contact means;
• a plurality of stacked semiconductor dies disposed over the substrate, the plurality of stacked semiconductor dies including:
• a top semiconductor die positioned above the substrate, the top semiconductor die including:
• a top surface;
• and
• a second contact means provided on the top surface;
• a connection means extending between and electrically connecting the second contact means of the top semiconductor die and the first contact means of the substrate;
• an insulative means disposed directly over the top semiconductor die, the insulative means contacting a portion of the connection means;
• and
• a resistance means disposed directly over the insulative means.