H10W 72/07553
Changes in shapes
Official title: {changes in shapes}
H10W72/07553 (Changes in shapes) appears on 1,301 US grants and 1,377 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,301
- Published applications
- 1,377
- Assignees
- 418
- Inventors
- 2,573
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 7 | 0 |
| 1990 | 1 | 0 |
| 1991 | 8 | 0 |
| 1992 | 11 | 0 |
| 1993 | 5 | 0 |
| 1994 | 13 | 0 |
| 1995 | 13 | 0 |
| 1996 | 7 | 0 |
| 1997 | 8 | 0 |
| 1998 | 13 | 0 |
| 1999 | 15 | 0 |
| 2000 | 28 | 0 |
| 2001 | 32 | 13 |
| 2002 | 40 | 43 |
| 2003 | 29 | 51 |
| 2004 | 39 | 40 |
| 2005 | 35 | 67 |
| 2006 | 42 | 63 |
| 2007 | 34 | 88 |
| 2008 | 38 | 89 |
| 2009 | 56 | 82 |
| 2010 | 68 | 94 |
| 2011 | 78 | 56 |
| 2012 | 67 | 56 |
| 2013 | 48 | 40 |
| 2014 | 48 | 44 |
| 2015 | 54 | 48 |
| 2016 | 45 | 45 |
| 2017 | 48 | 56 |
| 2018 | 48 | 59 |
| 2019 | 50 | 57 |
| 2020 | 47 | 56 |
| 2021 | 47 | 42 |
| 2022 | 50 | 51 |
| 2023 | 35 | 44 |
| 2024 | 26 | 35 |
| 2025 | 29 | 35 |
| 2026 | 21 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices29 Sep 2026US 12,751,297 B2Infineon Technologies Austria AG
- Methods related to dual-sided radio-frequency package with overmold structure25 Aug 2026US 12,721,179 B2Skyworks Solutions, Inc.
- Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies25 Aug 2026US RE51,016 E1Adeia Semiconductor Technologies LLC
- Wire bonds for galvanic isolation device18 Aug 2026US 12,713,629 B2Texas Instruments Incorporated
- Semiconductor device and method of die attach with adhesive layer containing graphene-coated core11 Aug 2026US 12,708,038 B2STATS ChipPAC Pte. Ltd.
- Connecting semiconductor dies through traces8 Oct 2026US 2026/0314460 A1Micron Technology, Inc.
- Semiconductor package having a multi-layer film structure8 Oct 2026US 2026/0314477 A1SanDisk Technologies LLC
- Microelectronic device package with open cavity1 Oct 2026US 2026/0305456 A1Texas Instruments Incorporated
- Electronic Assembly, Electronic Device, and Preparation Method for Electronic Assembly6 Aug 2026US 2026/0231809 A1Huawei Technologies Co., Ltd.
- Semiconductor device30 Jul 2026US 2026/0223719 A1Sumitomo Electric Device Innovations, Inc.
Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Plural semiconductor die housed in common package with split heat sink266US 5,977,630 AInternational Rectifier Corporation · 1999
- Semiconductor device and method for manufacturing the same266US 6,307,272 B1Hitachi, Ltd. · 2001
- Semiconductor device and method of manufacturing the same219US 6,100,594 ASharp Kabushiki Kaisha · 2000
- Method for manufacturing raised electrical contact pattern of controlled geometry196US 6,215,670 B1FormFactor, Inc. · 2001