Semiconductor device and method of die attach with adhesive layer containing graphene-coated core

A semiconductor device, comprising:

• a substrate;
• a graphene core adhesive layer deposited on a surface of the substrate;
• and
• an electrical component affixed to the substrate with the graphene core adhesive layer,
• wherein the graphene core adhesive layer includes a plurality of graphene core shells each interconnected as each graphene core shell of the plurality of graphene core shells contacts another graphene core shell of the plurality of graphene core shells within the graphene core adhesive layer to form a continuous conduction path between the surface of the substrate and electrical component.

A method of making a semiconductor device, comprising:

• providing a substrate;
• depositing an adhesive layer including a plurality of graphene core shells over a surface of the substrate;
• and
• affixing an electrical component to the substrate with the adhesive layer, wherein the graphene core shells each are interconnected within the adhesive layer to form a continuous conduction path between the surface of the substrate and electrical component.

A method of making a semiconductor device, comprising:

• providing a substrate;
• depositing a graphene core adhesive layer over a surface of the substrate;
• and
• affixing an electrical component to the substrate with the graphene core adhesive layer,
• wherein the graphene core adhesive layer includes a plurality of graphene core shells each interconnected within the graphene core adhesive layer to form a continuous conduction path between the surface of the substrate and electrical component.