Microelectronic device package with open cavity

A method, comprising:

• forming sensor dies on a substrate, the sensor dies comprising a polymer dielectric on a device side surface of the sense dies;
• forming mold walls over the sensor dies on the substrate, the mold walls extending across a central portion of corresponding sensor dies, the mold walls defining open cavities over a portion of the polymer dielectric material on the corresponding sensor dies;
• singulating the sensor dies from the substrate into unit sensor dies, each unit sensor die having a corresponding mold wall over the device side surface of the unit sensor die;
• mounting a unit sensor die on a die pad of a leadframe, the leadframe having leads spaced from the die pad;
• forming wire bonds between bond pads on the unit sensor die and the leads of the package substrate;
• and
• covering a portion of the unit sensor die, the wire bonds, and a portion of the leads with mold compound, the mold compound forming a body of a microelectronic device package, the portion of the unit sensor die within the open cavity defined by the mold wall exposed from the body of the microelectronic device package.

An apparatus, comprising:

• a sensor die having a layer of sense material on a device side surface, and having bond pads on the device side surface;
• a mold wall formed over a central portion of the device side surface, the mold wall defining an open cavity over a portion of the sense material;
• the sensor die mounted on a device mounting surface of a package substrate, the package substrate having leads spaced from the device mounting surface;
• electrical connections coupling bond pads of the sensor die to the leads of the package substrate;
• and
• mold compound covering a portion of the sensor die, the electrical connections, and a portion of the leads, the mold compound forming a body of a microelectronic device package, wherein the portion of the sensor die within the open cavity defined formed by the mold wall is exposed from the body of the microelectronic device package.

A microelectronic device package with an open cavity, comprising:

• a sensor die having a layer of sense material on a device side surface;
• a mold wall formed over a central portion of the device side surface of the sensor die, the mold wall defining the open cavity over a portion of the sense material;
• the sensor die mounted on a die pad of a leadframe having leads spaced from the die pad;
• wire bond connections formed between the bond pads of the sensor die and the leads of the leadframe;
• and
• mold compound covering a portion of the sensor die, the wire bonds, and a portion of the leads, the mold compound forming the body of the microelectronic device package, wherein the portion of the sensor die within the open cavity defined by the mold wall is exposed from the body of the microelectronic device package.