Semiconductor device
AssigneeSumitomo Electric Device Innovations, Inc.
InventorSeiya TAKASHIMA
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Abstract
A semiconductor device includes a semiconductor chip including an amplifier, an input pad of the amplifier provided on an upper surface of the semiconductor chip, and an output pad of the amplifier provided on the upper surface of the semiconductor chip, input bonding wires each having a first end bonded to the input pad, and output bonding wires each having a first end bonded to the output pad. The input bonding wires include a first input bonding wire that is the thickest among the input bonding wires. A width of the output pad in a region to which at least one of first output bonding wires among the output bonding wires is bonded is larger than a largest width of the input pad in regions to which the input bonding wires are bonded. The first output bonding wires are thicker than the first input bonding wire.
Claims11
A semiconductor device comprising:
- a semiconductor chip including an amplifier, an input pad of the amplifier provided on an upper surface of the semiconductor chip, and an output pad of the amplifier provided on the upper surface of the semiconductor chip;
- input bonding wires each having a first end bonded to the input pad;
- and
- output bonding wires each having a first end bonded to the output pad,
- wherein the input bonding wires include a first input bonding wire that is the thickest among the input bonding wires, and
- wherein a width of the output pad in a region to which at least one of first output bonding wires among the output bonding wires is bonded is larger than a largest width of the input pad in regions to which the input bonding wires are bonded, the first output bonding wires being thicker than the first input bonding wire.
Dependencies are inferred from the claim text.