Electronic Assembly, Electronic Device, and Preparation Method for Electronic Assembly

An electronic device, comprising a circuit board, an electronic component, and an electronic assembly, wherein the electronic component is electrically connected to the electronic assembly, and the electronic component and the electronic assembly are disposed on the circuit board;

• the electronic assembly comprises a first component, a second component, and at least two wires, wherein the first component comprises a first pad, the second component comprises a second pad, and the at least two wires comprise a first wire and a second wire;
• the first wire is bonded between the first pad and the second pad, the second wire is also bonded between the first pad and the second pad, and the first wire and the second wire are connected in parallel;
• and
• a bond joint between the first wire and the first pad and a bond joint between the second wire and the first pad are stacked.

A preparation method for an electronic assembly, wherein the electronic assembly comprises a first component, a second component, a first wire, and a second wire, the first component comprises a first pad, and the second component comprises a second pad;

• and the preparation method comprises:
• bonding one end of the first wire to the first pad to form a first bond joint, and bonding the other end of the first wire to the second pad to form a second bond joint;
• bonding one end of the second wire to the first bond joint, and bonding the other end of the second wire to the second bond joint;
• and
• connecting the first wire and the second wire in parallel.

A preparation method for an electronic assembly, wherein the electronic assembly comprises a first component, a second component, a first wire, and a second wire, the first component comprises a first pad, and the second component comprises a second pad;

• and the preparation method comprises:
• bonding one end of the first wire to the first pad to form a first bond joint, and bonding the other end of the first wire to the second pad to form a second bond joint;
• bonding one end of the second wire to the first bond joint, and bonding the other end of the second wire to the second pad to form a third bond joint, wherein the second bond joint and the third bond joint are arranged side by side on a surface of the second pad;
• and
• connecting the first wire and the second wire in parallel.