H10W 72/07502
Using an auxiliary member
Official title: {using an auxiliary member}
H10W72/07502 (Using an auxiliary member) appears on 905 US grants and 813 published applications in this corpus.
Search patents in H10W- Granted patents
- 905
- Published applications
- 813
- Assignees
- 293
- Inventors
- 1,574
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 6 | 0 |
| 1991 | 10 | 0 |
| 1992 | 5 | 0 |
| 1993 | 10 | 0 |
| 1994 | 9 | 0 |
| 1995 | 11 | 0 |
| 1996 | 8 | 0 |
| 1997 | 8 | 0 |
| 1998 | 12 | 0 |
| 1999 | 27 | 0 |
| 2000 | 20 | 0 |
| 2001 | 24 | 19 |
| 2002 | 35 | 40 |
| 2003 | 25 | 39 |
| 2004 | 34 | 32 |
| 2005 | 26 | 31 |
| 2006 | 34 | 27 |
| 2007 | 27 | 32 |
| 2008 | 15 | 41 |
| 2009 | 24 | 44 |
| 2010 | 33 | 48 |
| 2011 | 44 | 49 |
| 2012 | 46 | 29 |
| 2013 | 39 | 34 |
| 2014 | 38 | 31 |
| 2015 | 41 | 41 |
| 2016 | 44 | 35 |
| 2017 | 30 | 39 |
| 2018 | 36 | 28 |
| 2019 | 27 | 37 |
| 2020 | 25 | 30 |
| 2021 | 18 | 25 |
| 2022 | 27 | 32 |
| 2023 | 24 | 14 |
| 2024 | 15 | 13 |
| 2025 | 12 | 11 |
| 2026 | 7 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wire guides, wire bonding systems, and related methods1 Sep 2026US 12,727,503 B2Kulicke and Soffa Industries, Inc.
- Semiconductor device package with wettable flanks14 Jul 2026US 12,685,207 B2Texas Instruments Incorporated
- Semiconductor package and method of manufacturing the semiconductor package5 May 2026US 12,622,000 B2Samsung Electronics Co., Ltd.
- Bond wire reliability and process with high thermal performance in small outline package21 Apr 2026US 12,610,815 B2Texas Instruments Incorporated
- Semiconductor devices and related methods17 Mar 2026US 12,581,975 B2Amkor Technology Singapore Holding Pte.Ltd.
- Ic sensor process utilizing gold wire-bonding24 Sep 2026US 2026/0293751 A1Microchip Technology Incorporated
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
- Improved bond wire reliability and process with high tehrmal performance in small outline package27 Aug 2026US 2026/0255958 A1
- Outer bending leadframe technology27 Aug 2026US 2026/0256030 A1Semiconductor Components Industries, LLC
- Semiconductor package and method of manufacturing the semiconductor package13 Aug 2026US 2026/0239631 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Methods for manufacturing a semiconductor package having a sacrificial layer553US 6,001,671 ATessera, Inc. · 1999
- Method for making semiconductor device having no die supporting surface430US 5,474,958 AMotorola, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Fabrication process of semiconductor package and semiconductor package390US 5,976,912 AHitachi Chemical Company, Ltd. · 1999
- Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film369US 5,200,362 AMotorola, Inc. · 1993