Bond wire reliability and process with high thermal performance in small outline package

An electronic device, comprising:

• a package structure having opposite first and second sides, and opposite third and fourth sides that are spaced apart from one another along a first direction;
• a lead having a first portion inside the package structure, and a second portion exposed outside the package structure;
• a heat slug spaced apart from the lead and having first and second portions, the first portion of the heat slug partially exposed outside the second, third and fourth sides of the package structure, the second portion of the heat slug including slots extending inwardly along the first direction and fins between respective pairs of the slots, the fins enclosed by the package structure and spaced apart from one another along a second direction that is orthogonal to the first direction;
• a semiconductor die attached to the heat slug;
• and
• a bond wire inside the package structure and having a first end connected to the first portion of the lead, and a second end connected to a circuit of the semiconductor die.