H10W 72/07504
The auxiliary member being temporary
Official title: {the auxiliary member being temporary, e.g. a sacrificial coating}
H10W72/07504 (The auxiliary member being temporary) appears on 654 US grants and 645 published applications in this corpus.
Search patents in H10W- Granted patents
- 654
- Published applications
- 645
- Assignees
- 206
- Inventors
- 1,140
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 5 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 12 | 0 |
| 2000 | 10 | 0 |
| 2001 | 15 | 10 |
| 2002 | 22 | 30 |
| 2003 | 16 | 28 |
| 2004 | 27 | 27 |
| 2005 | 20 | 24 |
| 2006 | 30 | 23 |
| 2007 | 24 | 23 |
| 2008 | 12 | 31 |
| 2009 | 19 | 36 |
| 2010 | 25 | 40 |
| 2011 | 40 | 44 |
| 2012 | 38 | 26 |
| 2013 | 36 | 28 |
| 2014 | 34 | 24 |
| 2015 | 33 | 33 |
| 2016 | 35 | 30 |
| 2017 | 27 | 31 |
| 2018 | 27 | 24 |
| 2019 | 22 | 33 |
| 2020 | 23 | 28 |
| 2021 | 13 | 20 |
| 2022 | 22 | 27 |
| 2023 | 21 | 11 |
| 2024 | 13 | 6 |
| 2025 | 9 | 5 |
| 2026 | 4 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor device package with wettable flanks14 Jul 2026US 12,685,207 B2Texas Instruments Incorporated
- Semiconductor devices and related methods17 Mar 2026US 12,581,975 B2Amkor Technology Singapore Holding Pte.Ltd.
- Roll to roll sintering system for wide inorganic tape material and sintered articles27 Jan 2026US 12,537,225 B2Corning Incorporated
- Integrated circuit packages to minimize stress on a semiconductor die27 Jan 2026US 12,538,804 B2Analog Devices International Unlimited Company
- Chip-last wafer-level fan-out with optical fiber alignment structure30 Dec 2025US 12,512,402 B2Ayar Labs, Inc.
- Ic sensor process utilizing gold wire-bonding24 Sep 2026US 2026/0293751 A1Microchip Technology Incorporated
- Semiconductor devices and related methods16 Jul 2026US 2026/0206625 A1Amkor Technology Singapore Holding Pte.Ltd.
- Chip-Last Wafer-Level Fan-Out with Optical Fiber Alignment Structure30 Apr 2026US 2026/0123486 A1Ayar Labs, Inc.
- Low profile sensor packages29 May 2025US 2025/0174616 A1Stmicroelectronics Pte Ltd
- Display substrate, tiled display panel and display device8 May 2025US 2025/0149522 A1Boe Technology Group Co., Ltd.
Most cited
By later US patents
- Methods for manufacturing a semiconductor package having a sacrificial layer553US 6,001,671 ATessera, Inc. · 1999
- Method for making semiconductor device having no die supporting surface430US 5,474,958 AMotorola, Inc. · 1995
- Fabrication process of semiconductor package and semiconductor package390US 5,976,912 AHitachi Chemical Company, Ltd. · 1999
- Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film369US 5,200,362 AMotorola, Inc. · 1993
- Plastic package with exposed die365US 5,894,108 ANational Semiconductor Corporation · 1999