Ic sensor process utilizing gold wire-bonding
AssigneeMicrochip Technology Incorporated
InventorsPatrick McFarland, Arthur B. Eck, Bomy Chen, Steve Nagel
Life of this patent
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Abstract
A semiconductor package comprises a lead frame in the semiconductor package, a chip mounted on the lead frame in the semiconductor package, a sensor in the semiconductor package, a first wire connected to the chip and to the lead frame, and a second wire connected to the sensor and to either the lead frame or the chip. A method comprises providing a lead frame, attaching a chip to the lead frame, wire bonding a first wire to the chip and the lead frame, wire bonding a second wire to either the chip or the lead frame, and depositing a sensor material on the second wire, whereby a sensor is formed.
Claims20
A semiconductor package comprising:
- a lead frame in the semiconductor package;
- a chip mounted on the lead frame in the semiconductor package;
- a first sensor in the semiconductor package;
- a first wire connected to the chip and to the lead frame;
- and
- a second wire connected to the sensor and to either the lead frame or the chip.
A method comprising:
- providing a lead frame;
- attaching a chip to the lead frame;
- wire bonding a first wire to the chip and the lead frame;
- wire bonding a second wire to either the chip or the lead frame;
- and
- depositing a first sensor material on the second wire, whereby a first sensor is formed.
A semiconductor sensor package manufactured by a method comprising:
- providing a lead frame;
- attaching a chip to the lead frame;
- wire bonding a first wire to the chip and the lead frame;
- wire bonding a second wire to either the chip or the lead frame;
- wire bonding a third wire to either the chip or the lead frame;
- and
- depositing a sensor material on the second and third wires, whereby a sensor is formed.
Dependencies are inferred from the claim text.