H10W 72/07507
The auxiliary member being a temporary substrate
Official title: {the auxiliary member being a temporary substrate, e.g. a removable substrate}
H10W72/07507 (The auxiliary member being a temporary substrate) appears on 199 US grants and 236 published applications in this corpus.
Search patents in H10W- Granted patents
- 199
- Published applications
- 236
- Assignees
- 87
- Inventors
- 455
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 2 | 1 |
| 2003 | 1 | 2 |
| 2004 | 2 | 2 |
| 2005 | 0 | 2 |
| 2006 | 2 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 3 |
| 2009 | 0 | 4 |
| 2010 | 1 | 4 |
| 2011 | 4 | 5 |
| 2012 | 4 | 7 |
| 2013 | 3 | 6 |
| 2014 | 2 | 12 |
| 2015 | 14 | 21 |
| 2016 | 22 | 22 |
| 2017 | 20 | 27 |
| 2018 | 23 | 21 |
| 2019 | 20 | 27 |
| 2020 | 20 | 25 |
| 2021 | 10 | 12 |
| 2022 | 19 | 14 |
| 2023 | 12 | 10 |
| 2024 | 10 | 5 |
| 2025 | 4 | 3 |
| 2026 | 4 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Display substrate, tiled display panel and display device8 May 2025US 2025/0149522 A1Boe Technology Group Co., Ltd.
- Semiconductor device assemblies and systems with one or more dies at least partially embedded in a redistribution layer (rdl) and methods for making the same6 Feb 2025US 2025/0046743 A1Micron Technology, Inc.
- Semiconductor device package with wettable flanks2 Jan 2025US 2025/0006510 A1Texas Instruments Incorporated
- Roll to roll sintering system for wide inorganic tape material and sintered articles12 Dec 2024US 2024/0413390 A1Corning Incorporated
Most cited
By later US patents
- Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP103US 8,263,434 B2STATS ChipPAC, Ltd. · 2012
- Semiconductor device packages with electromagnetic interference shielding91US 7,989,928 B2Advanced Semiconductor Engineering, Inc. · 2011
- Thin and heat radiant semiconductor package and method for manufacturing86US 6,646,339 B1Amkor Technology, Inc. · 2003
- Process of making carrier substrate and semiconductor device58US 6,423,643 B1Shinko Electric Industries Co., Ltd. · 2002
- Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors52US 8,076,765 B2Advanced Semiconductor Engineering, Inc. · 2011