Process of making carrier substrate and semiconductor device

A process for producing a semiconductor device comprising the following steps of:

• (a) forming a carrier substrate comprising:
• coating respective surfaces, including a reference surface, of a metallic base with etching resist;
• partially removing said etching resist on said reference surface of the metallic base so as to form a central vacant pattern, a ring-like vacant pattern at a periphery of said central vacant pattern, and a connection vacant pattern spaced from said ring-like vacant pattern;
• half-etching said metallic base by using said etching resist as a mask and side-etching a part of said metallic base between said central vacant pattern and said ring-like vacant pattern so as to form a mount recessed area including a central recessed area and a stepped recessed area located at a periphery of said central recessed area, a depth of said central recessed area from said reference surface being greater than that of said stepped recessed area from said reference surface and also form a peripheral recessed area spaced from said stepped recessed area and arranged at a peripheral region thereof;
• forming a mounting part metallic film, including a bottom area and a stepped area located at a periphery of said bottom area, and a connector part metallic film on said mount recessed area and on said peripheral recessed area, respectively;
• removing said etching resist from said metallic base;
• (b) mounting a semiconductor element, having at least one signal electrode and at least one ground electrode, on said bottom area of the mounting part metallic film;
• (c) electrically connecting said signal electrode of the semiconductor element to said connector part and electrically connecting said ground electrode of the semiconductor element to said stepped area of the mounting part metallic film;
• (d) shielding with a resin for shielding said semiconductor element, said electrical connecting means, and at least mounting/connecting sides of said mounting part metallic film and said connector part metallic film so as to form a shielded part;
• and
• (e) removing said shielded part from said carrier substrate together with said mounting part metallic film and said connector part metallic film.