Semiconductor device assemblies and systems with one or more dies at least partially embedded in a redistribution layer (rdl) and methods for making the same

A semiconductor device assembly, comprising:

• a redistribution layer (RDL) including a plurality of external contacts on a first side, a plurality of internal contacts on a second side opposite the first side, a continuous body of a single dielectric material extending from the first side to the second side, and conductive features;
• a first die at least partially embedded in the continuous body of the single dielectric material of the RDL, having an active surface and a back surface opposite the active surface, both the active surface and the back surface disposed between the first side and the second side of the RDL such that the back surface and the active surface are at least partially covered by the continuous body of the single dielectric material, and wherein the active surface of the first die faces toward the plurality of external contacts;
• one or more second dies disposed over the first die and the RDL, the one or more second dies electrically coupled to the internal contacts;
• and
• an encapsulant at least partially encapsulating the one or more second dies.