Chip-last wafer-level fan-out with optical fiber alignment structure

An electro-optical chip package, comprising:

• a redistribution layer;
• an electro-optical die flip-chip connected to the redistribution layer, a portion of the electro-optical die extending laterally over an opening in the redistribution layer, the opening in the redistribution layer formed along a portion of an outer lateral edge of the electro-optical chip package, the portion of the electro-optical die including a plurality of optical fiber alignment structures that extend to an edge of the electro-optical die that corresponds to the portion of the outer lateral edge of the electro-optical chip package, wherein the opening in the redistribution layer is shaped and sized to laterally encompass at least three adjacent sides of the plurality of optical fiber alignment structures formed within the electro-optical die;
• and
• a mold compound material disposed on the redistribution layer and partially around the electro-optical die, wherein the mold compound material is not disposed within the plurality of optical fiber alignment structures, and wherein the mold compound material is not disposed within the opening in the redistribution layer.

An electro-optical chip package, comprising:

• a redistribution layer;
• an electro-optical die flip-chip connected to the redistribution layer, a portion of the electro-optical die extending laterally over an opening in the redistribution layer, the opening in the redistribution layer formed along a portion of an outer lateral edge of the electro-optical chip package, the portion of the electro-optical die including a plurality of optical fiber alignment structures that extend to an edge of the electro-optical die that corresponds to the portion of the outer lateral edge of the electro-optical chip package;
• and
• a mold compound material disposed on the redistribution layer and partially around the electro-optical die, wherein the mold compound material is not disposed within the plurality of optical fiber alignment structures, and wherein the mold compound material is not disposed within the opening in the redistribution layer, wherein the mold compound material is planarized to expose a top surface of the electro-optical die.